Results 41 to 50 of about 386,628 (313)
Characterization of wafer-level thermocompression bonds [PDF]
, 2004 Thermocompression bonding joins substrates via a bonding layer. In this paper, silicon substrates were bonded using gold thin films. Experimental data on the effects of bonding pressure (30 to 120 MPa), temperature (260 and 300/spl deg/C), and time (2 to
Tsau, C.H. +2 more
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Beilstein Journal of Organic Chemistry, 2015 Fifteen cyclic and acylic carbenes have been calculated with density functional theory at the BP86/def2-TZVPP level. The strength of the internal X→p(π) π-donation of heteroatoms and carbon which are bonded to the C(II) atom is estimated with the help of
Diego M. Andrada +3 more
doaj +1 more source
Faraday Discussions, 2003 The molecular and electronic structures of transition metal complexes, [MOCl5]n- (n = 2 for M = V,Nb,Ta and n = 1 for Mo,W) and mixed-metal polyoxometalates, [M'M5O19]3-V,Nb,Ta, M = Mo,W) containing a single terminal oxo group on each metal, and of complexes of the uranyl ion [UO2]2+, [UO2(H2O)5]2+ and [UO2Cl4]2-, have been calculated using density ...
Bridgeman, Adam, Cavigliasso, German
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Quantitative Analysis of Multiplex H-Bonds [PDF]
Journal of the American Chemical Society, 2020 H-bonding is the predominant geometrical determinant of biomolecular structure and interactions. As such, considerable analyses have been undertaken to study its detailed energetics. The focus, however, has been mostly reserved for H-bonds comprising a single donor and a single acceptor.
Esther S. Brielle, Isaiah T. Arkin
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Bonding and correlation analysis of various SiCO isomers [PDF]
, 2002 The structural properties for various SiCO isomers in the singlet and triplet states have been investigated using CASSCF methods with a 6-311 +G* basis set and also using three DFT and MP2 with same basis set for those systems except for the linear ...
Bu, YX, Han, KL
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A numerical study on thermal bonding with preheating technique for polypropylene microfluidic device
e-Polymers, 2023 This study presents a method for producing microfluidic chips from polypropylene using a pre-heated bonding area and thermal bonding technology. ANSYS was utilized to investigate the effects of bonding parameters and microchannel deformation and predict ...
Almezgagi Esam Abdulrahman +3 more
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Thin bonding wires temperature measurement using optical fiber sensors [PDF]
, 2011 In this work we demonstrate the use of optical fiber sensors to measure temperature in thin metallic bonding wires. Temperature was measured in copper wires with diameter of 0.10, 0.28, 0.60 and 0.70 mm and for different values of the driven electrical ...
P. Antunes +14 more
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Scientific Reports, 2022 Cu–Cu joints have been adopted for ultra-high density of packaging for high-end devices. However, cracks may form and propagate along the bonding interfaces during fatigue tests.
Jia-Juen Ong +6 more
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The Orbital Origins of Chemical Bonding in Phase-Change Materials [PDF]
, 2021 Layered phase-change materials in the Ge–Sb–Te-system are widely used in data storage and are the subject of intense research to understand the elusive quantum-chemical origin of their unique properties.
Peter C., Müller +3 more
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Materials & Design, 2021 Additive forging is a newly developed method to manufacture heavy forgings by using multilayer hot-compression bonding. However, the relationship between surface cleaning and bonding performance of bonded samples in the additive forging process is ...
Yong Zhao +8 more
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