Halogen bonding and chalcogen bonding mediated sensing [PDF]
Sigma–hole interactions, in particular halogen bonding (XB) and chalcogen bonding (ChB), have become indispensable tools in supramolecular chemistry, with wide-ranging applications in crystal engineering, catalysis and materials chemistry as well as ...
Paul D., Beer +3 more
core +1 more source
The Comparison of the Bonding Performance between the new Flash-free Orthodontic Bracket Bonding System and the Traditional Bracket Bonding System: A Systematic Review and Meta-analysis [PDF]
Background and aim: The purpose of this study was the comparison of the bonding performance between the new flash-free Orthodontic bracket bonding system and the traditional bracket bonding system.Material and methods: The present study is a systematic ...
Arkia Mardany +5 more
doaj +1 more source
Materials Integrations for High-Performance Photovoltaics by Wafer Bonding [PDF]
The fundamental efficiency limit for state of the art triple-junction photovoltaic devices is being approached. By allowing integration of non-lattice-matched materials in monolithic structures, wafer bonding enables novel photovoltaic devices that have ...
Zahler, James Michael
core +1 more source
Nanoporous gold as a versatile bonding intermediate
S.46On-chip nanoporous gold fabrication was developed with binary alloy deposition subsequently a dealloying process. Using this novel nanostructure as the bonding intermediate, nanoporous gold on one bonding substrate was boned to a thin gold film, that
Wang, W.-S. +3 more
core +1 more source
A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-Deposited Cu3N
PVD-deposited Cu3N has been demonstrated for Cu-Cu bonding as a low-cost passivation material. Cu3N exhibits stability at room temperature but undergoes decomposition upon heating, making it an attractive candidate for Cu bonding passivation.
Tzu-Heng Hung +4 more
doaj +1 more source
The molecular and electronic structures of transition metal complexes, [MOCl5]n- (n = 2 for M = V,Nb,Ta and n = 1 for Mo,W) and mixed-metal polyoxometalates, [M'M5O19]3-V,Nb,Ta, M = Mo,W) containing a single terminal oxo group on each metal, and of complexes of the uranyl ion [UO2]2+, [UO2(H2O)5]2+ and [UO2Cl4]2-, have been calculated using density ...
Bridgeman, Adam, Cavigliasso, German
openaire +2 more sources
Quantitative Analysis of Multiplex H-Bonds [PDF]
H-bonding is the predominant geometrical determinant of biomolecular structure and interactions. As such, considerable analyses have been undertaken to study its detailed energetics. The focus, however, has been mostly reserved for H-bonds comprising a single donor and a single acceptor.
Esther S. Brielle, Isaiah T. Arkin
openaire +2 more sources
A numerical study on thermal bonding with preheating technique for polypropylene microfluidic device
This study presents a method for producing microfluidic chips from polypropylene using a pre-heated bonding area and thermal bonding technology. ANSYS was utilized to investigate the effects of bonding parameters and microchannel deformation and predict ...
Almezgagi Esam Abdulrahman +3 more
doaj +1 more source
Quantum-Chemical Bonding Database (Unprocessed data : Part 6)
This data is associated with the manuscript "A Quantum-Chemical Bonding Database for Solid-State Materials." Refer to mpids.txt to see data related to which compounds are available in the tar file.
Benner, Phillip +5 more
core +1 more source
Utilizing an Improved EXAFS Structure Analysis Method to Reveal Site-Specific Bonding Properties of Ag44(SR)30 Nanoclusters [PDF]
Atomically precise nanoclusters (NCs) are of great interest due to their well-defined structures and molecule-like properties. Understanding their structure-property relationship is an important task because it can help tailor their structures to achieve
Daniel, Chevrier +4 more
core +2 more sources

