Results 41 to 50 of about 23,675,183 (257)
Scientific Reports, 2022 Cu–Cu joints have been adopted for ultra-high density of packaging for high-end devices. However, cracks may form and propagate along the bonding interfaces during fatigue tests.
Jia-Juen Ong +6 more
doaj +1 more source
Direct bonding with on-wafer metal interconnections
, 2022 S.391-396A low temperature direct bonding process with encapsulated metal interconnections was proposed. The process can be realized between silicon wafers or silicon and glass wafers.
Jia, C., Wiemer, M., Gessner, T.
core +1 more source
Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses
Advances in Materials Science and Engineering, 2017 In order to effectively reduce the thermal stresses of Si/GaAs bonding wafers during their annealing process, first of all, based on E. Suhir’s bimaterial thermal stress theory, the thermal stresses in the wafer bonding interfaces are analyzed and the ...
Yuanying Qiu +4 more
doaj +1 more source
Materials & Design, 2021 Additive forging is a newly developed method to manufacture heavy forgings by using multilayer hot-compression bonding. However, the relationship between surface cleaning and bonding performance of bonded samples in the additive forging process is ...
Yong Zhao +8 more
doaj +1 more source
Chemical Bonding Analysis in Ti1-x-yAlxTayN Solid Solutions [PDF]
, 2019 A comprehensive study of the evolution of electronic structure and chemical bonding in disordered Ti1-xAlxN and Ti1-x-y AlxTayN systems was performed by means of ab initio density functional theory calculations using crystal orbital Hamilton population ...
Sergey, Eremeev, A. R., Shugurov
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Molecules, 2022 The work carried out by our research group over the last couple of decades in the context of quantitative crystal engineering involves the analysis of intermolecular interactions such as carbon (tetrel) bonding, pnicogen bonding, chalcogen bonding, and ...
Sajesh P. Thomas +6 more
doaj +1 more source
Low temperature metal interdiffusion bonding for micro devices
, 2022 S.163We demonstrate solid liquid interdiffusion bonding by gallium and gold as bonding material and show the bonding at 40°C. Because of the low melting point of gallium of 29.8°C several difficulties for processing the gallium exists.
Wiemer, Maik +4 more
core +1 more source
Degradation mechanism of the von Willebrand factor A2 domain by nattokinase
FEBS Letters, EarlyView.Nattokinase, a natto‐derived protease, exhibits potent antithrombotic effects. This study demonstrates that nattokinase directly cleaves the von Willebrand factor (vWF) A2 domain in vitro. Unlike the native regulator ADAMTS13, nattokinase degrades folded vWF independently of shear stress.
Ryuichi Hyakumoto +3 more
wiley +1 more source
Wafer bonding for optical MEMS
, 2022 S.184-193A low temp. direct bonding method that is CMOS compatible is described. The method is applied in the manufg. of advanced spatial light modulators with a matrix of up to 512 * 2048 individually addressable monocryst. silicon mirrors.
Völker, B. +4 more
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Advances in Civil Engineering, 2021 The critical influencing factors of the interface bonding properties of concrete-filled steel tubes (CFSTs) under fire and postfire conditions are analyzed.
Yuanyuan Xue +3 more
doaj +1 more source