Results 51 to 60 of about 383,872 (313)
A numerical study on thermal bonding with preheating technique for polypropylene microfluidic device
e-Polymers, 2023 This study presents a method for producing microfluidic chips from polypropylene using a pre-heated bonding area and thermal bonding technology. ANSYS was utilized to investigate the effects of bonding parameters and microchannel deformation and predict ...
Almezgagi Esam Abdulrahman +3 more
doaj +1 more source
Quantum-Chemical Bonding Database (Unprocessed data : Part 5)
, 2023 <p>This dataset is published as part of our publication: <a href="https://www.nature.com/articles/s41597-023-02477-5">A Quantum-Chemical Bonding Database for Solid-State Materials</a></p><p>Refer to mpids.txt to see data ...
Naik, Aakash Ashok +4 more
core +1 more source
Quantum-Chemical Bonding Database (Unprocessed data : Part 2)
, 2023 <p>This dataset is published as part of our publication: <a href="https://www.nature.com/articles/s41597-023-02477-5">A Quantum-Chemical Bonding Database for Solid-State Materials.
Naik, Aakash Ashok +4 more
core +1 more source
Beilstein Journal of Organic Chemistry, 2015 Fifteen cyclic and acylic carbenes have been calculated with density functional theory at the BP86/def2-TZVPP level. The strength of the internal X→p(π) π-donation of heteroatoms and carbon which are bonded to the C(II) atom is estimated with the help of
Diego M. Andrada +3 more
doaj +1 more source
Scientific Reports, 2022 Cu–Cu joints have been adopted for ultra-high density of packaging for high-end devices. However, cracks may form and propagate along the bonding interfaces during fatigue tests.
Jia-Juen Ong +6 more
doaj +1 more source
Local Spin Analysis and Chemical Bonding
Chemistry – A European Journal, 2013 AbstractThe electronic structure of main‐group diatomic molecules is discussed in the light of local spin analysis. A deep investigation into the origin of local spins and their coupling is presented. It is shown that the presence of significant local spins in bonded molecules flags deviations from the classical bonding prototypes.
Ramos-Cordoba Eloy +2 more
openaire +3 more sources
Materials & Design, 2021 Additive forging is a newly developed method to manufacture heavy forgings by using multilayer hot-compression bonding. However, the relationship between surface cleaning and bonding performance of bonded samples in the additive forging process is ...
Yong Zhao +8 more
doaj +1 more source
A Quantum-Chemical Bonding Database for Solid-State Materials (JSONS: Part 2)
, 2023 This database consists of bonding data computed using Lobster for 1520 solid-state compounds consisting of insulators and semiconductors. The files are named as per ID numbers in the materials project database.
Benner, Phillip +4 more
core +1 more source
Continuing Bonds and Grief: A Prospective Analysis
Death Studies, 2006 Using data of 56 bereaved individuals, this study examined associations of various manifestations of continuing bonds, assessed at 7-12 months post-loss, with concurrent and prospective (9 months later) symptoms of grief and depression. Among other things it was found that, independent of initial symptom levels, manifestations of continuing bonds ...
Boelen, P.A. +3 more
openaire +4 more sources
Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses
Advances in Materials Science and Engineering, 2017 In order to effectively reduce the thermal stresses of Si/GaAs bonding wafers during their annealing process, first of all, based on E. Suhir’s bimaterial thermal stress theory, the thermal stresses in the wafer bonding interfaces are analyzed and the ...
Yuanying Qiu +4 more
doaj +1 more source