Results 51 to 60 of about 22,611,724 (309)
Scientific Reports, 2022 Cu–Cu joints have been adopted for ultra-high density of packaging for high-end devices. However, cracks may form and propagate along the bonding interfaces during fatigue tests.
Jia-Juen Ong +6 more
doaj +1 more source
Fabrication of wafer-level thermocompression bonding
, 2002 Thermocompression bonding of gold is a promising technique for achieving low temperature, wafer-level bonding. The fabrication process for wafer bonding at 300ºC via compressing gold under 7 MPa of pressure is described in detail.
Tsau, C.H. +2 more
core +1 more source
Continuing Bonds and Grief: A Prospective Analysis
Death Studies, 2006 Using data of 56 bereaved individuals, this study examined associations of various manifestations of continuing bonds, assessed at 7-12 months post-loss, with concurrent and prospective (9 months later) symptoms of grief and depression. Among other things it was found that, independent of initial symptom levels, manifestations of continuing bonds ...
Boelen, P.A. +3 more
openaire +4 more sources
Chemical Bonding Analysis in Ti1-x-yAlxTayN Solid Solutions [PDF]
, 2019 A comprehensive study of the evolution of electronic structure and chemical bonding in disordered Ti1-xAlxN and Ti1-x-y AlxTayN systems was performed by means of ab initio density functional theory calculations using crystal orbital Hamilton population ...
Sergey, Eremeev, A. R., Shugurov
core +1 more source
Quantum-Chemical Bonding Database (Unprocessed data : Part 8)
, 2023 This data is associated with the manuscript "A Quantum-Chemical Bonding Database for Solid-State Materials." Refer to mpids.txt to see data related to which compounds are available in the tar file.
Benner, Phillip +5 more
core +1 more source
Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses
Advances in Materials Science and Engineering, 2017 In order to effectively reduce the thermal stresses of Si/GaAs bonding wafers during their annealing process, first of all, based on E. Suhir’s bimaterial thermal stress theory, the thermal stresses in the wafer bonding interfaces are analyzed and the ...
Yuanying Qiu +4 more
doaj +1 more source
Materials & Design, 2021 Additive forging is a newly developed method to manufacture heavy forgings by using multilayer hot-compression bonding. However, the relationship between surface cleaning and bonding performance of bonded samples in the additive forging process is ...
Yong Zhao +8 more
doaj +1 more source
Molecules, 2022 The work carried out by our research group over the last couple of decades in the context of quantitative crystal engineering involves the analysis of intermolecular interactions such as carbon (tetrel) bonding, pnicogen bonding, chalcogen bonding, and ...
Sajesh P. Thomas +6 more
doaj +1 more source
Low temperature thermo compression bonding with printed intermediate bonding layers
, 2022 S.299-310The paper describes capabilities of additive material transfer technologies Aerosol Jet Printing (AJP), Stencil Printing (STP) and Screen Printing (SP) based on nano particle inks with the purpose of intermediate bond layer manufacturing for ...
Wiemer, Maik +5 more
core +1 more source
Micromachines, 2023 This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire.
Hongliang Zhou +8 more
doaj +1 more source