Results 1 to 10 of about 2,632 (215)

Investigation of critical material removal transitions in compliant machining of brittle ceramics

open access: yesMaterials & Design, 2020
Compliant machining processes, such as bonnet polishing, can be used on hard and brittle ceramic materials such as alumina and silicon carbide, to produce ultra-precise surfaces with sub-micron form accuracy and nanometric surface roughness.
Wu-Le Zhu, Beaucamp Anthony
doaj   +3 more sources

Analysis of Surface Characteristics and Spoke-shaped Removal through Ultra-precision Machining of Germanium Materials [PDF]

open access: yes한국정밀공학회지, 2023
Germanium, an optical material, has high transmittance and refractive index and low light scattering in the infrared region, and research is being conducted to utilize it in various industrial fields.
Joong kyu Ham   +9 more
doaj   +1 more source

Data-Driven Modeling and Prediction Analysis for Surface Roughness of Special-Shaped Stone by Robotic Grinding

open access: yesIEEE Access, 2022
This paper aims to accurately predict the surface quality of the special-shaped stone by robotic grinding and effectively guide the adjustment of process parameters to ensure stable grinding quality, applies a support vector machine model based on ...
Fangchen Yin, Qingzhi Ji, Changcai Cun
doaj   +1 more source

Mueller Matrix Ellipsometric Characterization of Nanoscale Subsurface Damage of 4H-SiC Wafers: From Grinding to CMP

open access: yesFrontiers in Physics, 2022
Subsurface damage of 4H-silicon carbide (SiC) wafers, which is detrimental to the performance and lifetime of SiC-based photoelectric devices, is easily induced during surface machining process due to their particular mechanical and physical properties ...
Huihui Li   +14 more
doaj   +1 more source

Study of grinding and polishing tools in automated processing of curved stone

open access: yesCase Studies in Construction Materials, 2022
The grinding and polishing of curved stone involve many steps, limiting the process's efficiency. This study proposes a one-step grinding and polishing process to simplify the process and achieve efficient machining.
Yun Shen, Jing Lu, Changcai Cui
doaj   +1 more source

Characterization of amorphous carbon films from 5 nm to 200 nm on single-side polished a-plane sapphire substrates by spectroscopic ellipsometry

open access: yesFrontiers in Physics, 2022
In this work, a series of amorphous carbon films were deposited on a-plane sapphire substrates by magnetron sputtering with deposition time from 15 min to 8 h, in order to investigate the thickness and optical properties in the process of growth in a non-
Ziqing Li   +12 more
doaj   +1 more source

Understanding the Mechanisms of SiC–Water Reaction during Nanoscale Scratching without Chemical Reagents

open access: yesMicromachines, 2022
Microcracks inevitably appear on the SiC wafer surface during conventional thinning. It is generally believed that the damage-free surfaces obtained during chemical reactions are an effective means of inhibiting and eliminating microcracks.
Zhihao Cheng   +3 more
doaj   +1 more source

Investigation of Surface Integrity Induced by Ultra-Precision Grinding and Scratching of Glassy Carbon

open access: yesMicromachines, 2023
Glassy carbon provides material characteristics that make it a promising candidate for use as a mould material in precision glass moulding. However, to effectively utilize glassy carbon, a thorough investigation into the machining of high-precision ...
Kirk Jahnel   +4 more
doaj   +1 more source

Prediction of subsurface microcrack depth of brittle materials based on co-training SVR

open access: yesJin'gangshi yu moliao moju gongcheng, 2023
In order to overcome the dilemma of insufficient effective sample number for subsurface microcrack depth in the lapping of brittle materials with fixed abrasives and achieve accurate prediction, a co-training SVR was used to construct the prediction ...
Chuang REN   +3 more
doaj   +3 more sources

Numerical study on dynamic crack propagation of brittle materials by discontinuous deformation analysis

open access: yesYantu gongcheng xuebao, 2022
The discontinuous deformation analysis (DDA), as an implicit discrete element method, can simulate the evolution process from continuum to failure by introducing the virtual joint technology.
ZHANG Kai-yu 1, 2, LIU Feng 1, 2, XIA Kai-wen 1, 2
doaj   +1 more source

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