Results 41 to 50 of about 49,671 (256)

Study on electrochemical mechanical polishing of silicon carbide substrates with controllable material removal behavior

Journal of Materials Research and Technology
Electrochemical mechanical polishing (ECMP) shows great potential for improving the polishing efficiency and surface quality of silicon carbide (SiC) substrates.
Qiufa Luo, Dianlong Lin, Yongkang Xin, Jing Lu, Congming Ke, Jianhui Zhu, Hui Huang   +6 more
doaj   +1 more source

Institutional and technical history of requirements‐based strategic armor ceramics basic research leading up to the multiscale material by design materials in extreme dynamic environments (MEDE) program. Part I. Brief history of institutional changes and relevant major research programs

International Journal of Ceramic Engineering & Science, 2023
History, beginning in the late 1960s during the Vietnam war, of the institutional changes that took place because of various military operations and the resulting changes in policies and requirements in the Department of Defense and the Army: Army Force ...
James W. McCauley
doaj   +1 more source

Pyramidal Structures on Yttria‐Stabilized Zirconia after High Temperature Exposure at 1500°C: New Features on an Old Material

Advanced Engineering Materials, EarlyView.
New features on yttria‐stabilized zirconia after exposure at 1500°C: Newly discovered pyramidal structures on an old material. After exposure at 1550°C on the cross section of YSZ new features, namely pyramidal structures are discovered. These structures grow with time, increase in numbers, appear as singularities, are often arranged in strings, and ...
Doris Sebold, Dylan Jennings, Robert Vaßen   +2 more
wiley   +1 more source

Solid‐State Diffusion and Intermetallic Phase Formation in Roll‐Bonded Mg–Zn Composites With Kirigami‐Patterned Inlay

Advanced Engineering Materials, EarlyView.
Mg–Zn composites with a thickness of 0.21 mm were fabricated using roll bonding of a kirigami‐patterned Mg alloy inlay within a Zn matrix. Thermal activation following this process led to the formation of tailored intermetallic structures, which provided the composite with enhanced flexural strength.
Yaroslav Frolov, Oleksandr Bobukh, Christian Klose, Florian Nürnberger, Hans Jürgen Maier   +4 more
wiley   +1 more source

Critical Depth of Hard Brittle Materials on Nano Plastic Forming

Journal of Advanced Mechanical Design, Systems, and Manufacturing, 2008
This paper reports on ductile to brittle transition of hard brittle materials in nano plastic forming process. Formability of some hard brittle materials, i.e., glasses, silicon and quartz wafers, were examined through a specially designed and developed ...
Masahiko YOSHINO, Aravindan SIVANANDAM, Yuki KINOUCHI, Takashi MATSUMURA   +3 more
doaj   +1 more source

Phase Field Failure Modeling: Brittle‐Ductile Dual‐Phase Microstructures under Compressive Loading

Advanced Engineering Materials, EarlyView.
The approach by Amor and the approach by Miehe and Zhang for asymmetric damage behavior in the phase field method for fracture are compared regarding their fitness for microcrack‐based failure modeling. The comparison is performed for the case of a dual‐phase microstructure with a brittle and a ductile constituent.
Jakob Huber, Jan Torgersen, Ewald Werner
wiley   +1 more source

Efficient Semi-Transparent Wide-Bandgap Perovskite Solar Cells Enabled by Pure-Chloride 2D-Perovskite Passivation

Nano-Micro Letters, 2023
Highlights Three bulky cation chlorides (PMACl, PEACl and NMACl) are used to modify the perovskite surface and form pure-anion 2D (PMA)2PbCl4, mixed-anion 2D (PEA)2Pb(I x Cl4-x ), and non-2D NMAI passivation layers, respectively.
Liu Yang, Yongbin Jin, Zheng Fang, Jinyan Zhang, Ziang Nan, Lingfang Zheng, Huihu Zhuang, Qinghua Zeng, Kaikai Liu, Bingru Deng, Huiping Feng, Yujie Luo, Chengbo Tian, Changcai Cui, Liqiang Xie, Xipeng Xu, Zhanhua Wei   +16 more
doaj   +1 more source

Sawing Force Prediction Model and Experimental Study on Vibration-Assisted Diamond Wire Sawing

Micromachines, 2022
Diamond wire sawing is the main machining technology for slicing various brittle materials, such as crystalline silicon, SiC, and NdFeB. Due to their high hardness and high brittleness, as well as the ease with which the surfaces of machined materials ...
Chenpu Zhang, Zhikui Dong, Yanheng Zhao, Ziliang Liu, Shang Wu, Jiahao Yang   +5 more
doaj   +1 more source

Karl Popper and the Mechanisms of Hydrogen Embrittlement

Advanced Engineering Materials, EarlyView.
Representation of the beginning of loss of ductility rather than embrittlement. Small concentrations of hydrogen in a diffusible form within iron are well‐established to harm the mechanical integrity of steels. There are theories that attempt to explain the pernicious role of hydrogen.
H. K. D. H. Bhadeshia
wiley   +1 more source

Modeling of grinding chip thickness distribution based on material removel mode in grinding of SiC ceramics

Journal of Advanced Mechanical Design, Systems, and Manufacturing, 2020
Grinding chip thickness is an important parameter to reflect the grinding efficiency and investigate the grinding mechanism. Modeling of the chip thickness is generally based on a certain stochastic distribution model, like Uniform, Gaussian or Rayleigh ...
Chongjun WU, Wanjiao DONG, Lijian ZHU, Jian ZHANG, Lijun XU, Steven Y LIANG   +5 more
doaj   +1 more source