Results 211 to 220 of about 13,470 (259)

Synchronization Phenomena in Microgrids With Capacitive Coupling

IEEE Journal on Emerging and Selected Topics in Circuits and Systems, 2015
Multiple converters connected to a microgrid must have the same clock frequency, else interaction among the frequencies may cause beating noise. But the frequency equalization is difficult to achieve in practice. We show that the nonlinearity present in all power electronic systems offers an interesting possibility: the clocks may synchronize ...
Kuntal Mandal, Soumitro Banerjee
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Accurate Decoupling of Capacitively Coupled Buses

2005 IEEE International Symposium on Circuits and Systems, 2005
This paper proposes a fast and accurate algorithm to decouple the lines of capacitively coupled buses. Simulation results show that the proposed algorithm accurately estimates the equivalent capacitances and delay of the coupled buses with an average error of 3.0% and a maximum error of 4.5%.
Maged Ghoneima, Yehea I. Ismail
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Capacitive Coupled Communication

2010
Capacitive coupled communication is a wireless chip to chip communication technology that uses capacitive coupling to transfer signals from a chip to neighboring chips. Its high-bandwidth, low-power, and low-latency chip-to-chip I/O capabilities enable the construction of high-performance and economical multi-chip modules (MCMs).
David Hopkins, Alex Chow, Frankie Liu, Dinesh D. Patil, Hans Eberle   +4 more
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A Capacitance-Coupled Bit Line Cell

IEEE Journal of Solid-State Circuits, 1985
A 38-µm2dynamic random-access memory (dRAM) cell with a capacitance-coupled bit line (CCB) approach is described. This cell enables a storage capacitor area 2-2.5 times larger than double polysilicon-type cells, or half the cell area with the same design rules.
M. Taguchi, S. Ando, S. Hijiya, T. Nakamura, S. Enomoto, T. Yabu   +5 more
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Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011
Three dimensions packaging provides a very promising technology for the effective integration of complex systems: devices that are optimally implemented with various different technologies can be separately manufactured and then stacked and connected by means of efficient vertical interconnections over a very short range; this provides most of the ...
Sheng-Feng Hsiao, Ming-Kun Chen, Yi-Lung Lin, Yu-Jung Huang, Shen-Li Fu   +4 more
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Estimation of the likelihood of capacitive coupling noise

Proceedings of the 39th conference on Design automation - DAC '02, 2002
The corruption of signals due to capacitive and inductive coupling of interconnects has become a significant problem in the design of deep submicron circuits (DSM). Noise simulators, based on worst-case assumptions, are overly pessimistic. As a result, when they are used on industrial ICs with hundreds of thousands of nets, thousands of nets are ...
Sarma B. K. Vrudhula, David T. Blaauw, Supamas Sirichotiyakul   +2 more
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Applications For Capacitively Coupled Resistivity Suvreys In Florida

17th EEGS Symposium on the Application of Geophysics to Engineering and Environmental Problems, 2004
In Florida, U.S., geophysical surveys for geotechnical engineering applications are usually performed by ground-penetrating radar (GPR). Such surveys are typically limited to a maximum depth of about 4.5–9 m due to attenuation of the signal by the shallow water table common in most of Florida.
K. Michael Garman, Scott F. Purcell
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Analysis of Capacitive Coupling within Microelectrode Array

2006 International Conference of the IEEE Engineering in Medicine and Biology Society, 2006
Capacitive coupling within high-density microelectrode arrays can degrade neural recording signal or disperse neural stimulation current. Material deterioration in a chronically implanted neural stimulation/recording system can cause such an undesired effect.
Zhe Hu, Philip R. Troyk, David E. Detlefsen   +2 more
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Capacitance-coupling micromechanical filter

SPIE Proceedings, 2001
It is a focus to study the micromechanical filter coupled by a number of resonators, because the micromechanical resonators have a high quality factor (Q). At present, the structures of flexural vibration of coupling beam and elastic vibration of rectangle frame are mainly studied methods of coupling.
Binking Zhang, Qing-An Huang
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Capacitively Coupled Multichip Modules

Proceedings of the International Conference on Multichip Modules, 2005
This paper introduces a radically new method for interconnecting electronic packages electrically and mechanically. It applies to Levels 0-3 inclusive, including die-to-die (Level 0 - Level 0), die-to- substrate (0-1), substrate-to-substrate (1-1), module-to- module (2-2), and substrate to cable or backplane (1-3).
D.B. Salzman, T.F. Knight
openaire   +1 more source