Results 111 to 120 of about 18,025 (163)

Modeling of Polishing Regimes in Chemical Mechanical Polishing

MRS Proceedings, 2005
AbstractChemical mechanical polishing (CMP) is widely used for local and global planarization of microelectronic devices. It has been demonstrated experimentally in the literature that the polishing performance is a result of the synergistic effect of both the chemicals and the particles involved in CMP.
Suresh B. Yeruva, Chang-Won Park, Brij M. Moudgil   +2 more
openaire   +1 more source

Progressive Mechanical and Chemical Polishing

Topical Meeting on the Science of Polishing, 1984
The reproducible preparation of mirror-like, damage-free and optically flat surfaces is crucial to the fabrication of high performance semiconductor or optical devices. Therefore, various polishing methods have been proposed and successed for finishing a brittle or a metallic material surface.
Toshio Kasai, Akira Kobayashi
openaire   +1 more source

Electro-chemical mechanical polishing of silicon carbide

Journal of Electronic Materials, 2004
In an effort to improve the silicon carbide (SiC) substrate surface, a new electro-chemical mechanical polishing (ECMP) technique was developed. This work focused on the Si-terminated 4H-SiC (0001) substrates cut 8° off-axis toward 〈1120〉. Hydrogen peroxide (H2O2) and potassium nitrate (KNO3) were used as the electrolytes while using colloidal silica ...
Can Hua Li, Rong Jun Wang, Joseph Seiler, I. Bhat   +3 more
openaire   +1 more source

Analytical solution for polish-rate decay in chemical–mechanical polishing

Journal of Engineering Mathematics, 2010
zbMATH Open Web Interface contents unavailable due to conflicting licenses.
Shi, Hong, Ring, Terry A.
openaire   +1 more source

Simulation of Particle Adhesion: Implications in Chemical Mechanical Polishing and Post Chemical Mechanical Polishing Cleaning

Journal of The Electrochemical Society, 2001
We have previously described a model and a simulation approach to describe the adhesive interaction between a particle and a substrate. In this paper, we use the validated simulation to describe the adhesive interaction for alumina particles in contact with dielectric and metal films relevant to chemical mechanical polishing (CMP) and post-CMP cleaning
Kevin Cooper, Anand Gupta, Stephen Beaudoin   +2 more
openaire   +1 more source

Chemical Mechanical Polish for Nanotechnology

2011
Chemical mechanical polish (CMP) is a process technology that was adapted from wafer polishing to IC fabrication and thereby enabled the semiconductor industry to extend optical lithography and invent novel approaches such as damascene interconnects.
L. Nolan, K. Cadien
openaire   +1 more source

Modeling of Polishing Pad Wear in Chemical Mechanical Polishing

Key Engineering Materials, 2010
The polishing pad’s wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is established using the idea of Finite Element Analysis (FEA) and the effect of polishing parameters on the wear of polishing pad is discussed.
Mao Li, Yong Wei Zhu, Jun Li, Kui Lin
openaire   +1 more source

A statistical polishing pad model for chemical-mechanical polishing

Proceedings of IEEE International Electron Devices Meeting, 2002
Chemical mechanical polishing (CMP) has emerged as a critical technology for advanced integrated circuit fabrication. This paper presents for the first time a physical CMP model that includes the effects of polishing pad roughness and dynamic interaction between pad and wafer.
null Tat-Kwan Yu, C.C. Yu, M. Orlowski
openaire   +1 more source

Chemical-Mechanical Polishing of Optical Glasses

MRS Proceedings, 2009
AbstractThis paper presents the Chemical-Mechanical Polishing of optical and fine-optical glasses, which is employed to fulfill the optical requirements for the surfaces of optical lenses. We present the effect of chemical interactions in the polishing process of optical lenses and show how these interactions can be influenced by the additions of ...
Elisabeth Becker, Andreas Prange, Reinhard Conradt   +2 more
openaire   +1 more source

Transport Phenomena in Chemical Mechanical Polishing

Journal of The Electrochemical Society, 1999
Chemical mechanical polishing (CMP) is currently being used in the fabrication of integrated circuits and has been identified as an enabling technology for the semiconductor industry in its drive toward gigabit chips and subquartermicron feature sizes in the near future.
R. Shankar Subramanian, Lu Zhang, S. V. Babu   +2 more
openaire   +1 more source