Results 11 to 20 of about 54,421 (264)
Micromachines, 2023 This study aims to establish an accurate prediction model using artificial neural networks (ANNs) to effectively and efficiently predict the process-induced warpage of a flip-chip chip-scale package (FCCSP).
Hsien-Chie Cheng +2 more
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FCCSP IMC growth under reliability stress follows automotive criteria [PDF]
PSU Research Review, 2019 Purpose – The Kirkendall void had been a well-known issue for long-term reliability of semiconductor interconnects; while even the KVs exist at the interfaces of Cu and Sn, it may still be able to pass the condition of unbias long-term reliability ...
Wei Wei Liu, Berdy Weng, Scott Chen
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High Vacuum Packaging of MEMS Devices Containing Heterogeneous Discrete Components
Applied Sciences, 2021 Vacuum packaging of Micro-electro-mechanical system (MEMS) devices is a hot topic for its advantages of improving performance and reducing power consumption.
Ping Guo +4 more
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How to Wire a 1000-Qubit Trapped-Ion Quantum Computer
PRX Quantum, 2023 One of the most formidable challenges of scaling up quantum computers is that of control-signal delivery. Today’s small-scale quantum computers typically connect each qubit to one or more separate external signal sources.
M. Malinowski +2 more
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Development and Applications of Embedded Passives and Interconnects Employing Nanomaterials
Nanomaterials, 2022 The advent of nanotechnology has initiated a profound revolution in almost all spheres of technology. The electronics industry is concerned with the ongoing miniaturization of devices and as such requires packaging technologies that will make the devices
Shanggui Deng +8 more
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Robust Pressure Sensor in SOI Technology with Butterfly Wiring for Airfoil Integration
Sensors, 2021 Current research in the field of aviation considers actively controlled high-lift structures for future civil airplanes. Therefore, pressure data must be acquired from the airfoil surface without influencing the flow due to sensor application.
Jan Niklas Haus +6 more
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Frontiers in Bioinformatics, 2022 DNA methylation-based copy number variation (CNV) calling software offers the advantages of providing both genetic (copy-number) and epigenetic (methylation) state information from a single genomic library.
Michael P. Mariani +7 more
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Fabrication Process and Performance Analysis of CSP LED Filaments with a Stacked Package Design
Applied Sciences, 2018 This article presents a chip-scale package (CSP) based filament light-emitting diodes (LEDs) with a stacked-type structure and a segmented-type luminescence design for higher luminous efficiency and better electrical stability.
Nan Jiang +9 more
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Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements
Scientific Reports, 2021 Combining semiconductor optical amplifiers (SOA) on direct-bandgap III–V substrates with low-loss silicon or silicon-nitride photonic integrated circuits (PIC) has been key to chip-scale external-cavity lasers (ECL) that offer wideband tunability along ...
Yilin Xu +14 more
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CHRONO: a parallel multi-physics library for rigid-body, flexible-body, and fluid dynamics [PDF]
Mechanical Sciences, 2013 The last decade witnessed a manifest shift in the microprocessor industry towards chip designs that promote parallel computing. Until recently the privilege of a select group of large research centers, Teraflop computing is becoming a commodity owing to ...
H. Mazhar +7 more
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