Results 21 to 30 of about 54,421 (264)

Failure Analysis Challenges for Chip-Scale Packages [PDF]

EDFA Technical Articles, 2013
Abstract Chip-scale packages (CSPs) make efficient use of space on PCBs, but their small size, multilevel stacking arrangements, and complex interconnects present serious challenges when it comes to testing and failure analysis. This article describes some of the problems encountered when dealing with various types of CSPs and provides ...
openaire   +1 more source

A Cross-Scale Electrothermal Co-Simulation Approach for Power MOSFETs at Device–Package–Heatsink–Board Levels

Micromachines
This paper proposes a cross-scale simulation approach for evaluating the steady-state electrothermal performance of power MOSFETs at the device–package–heatsink–board (DPHB) level.
Yuxuan Dai, Jiafei Yao, Jing Chen, Qingyou Qian, Maolin Zhang, Jun Zhang, Qing Yao, Chenyang Huang, Mingshun Sun, Yufeng Guo   +9 more
doaj   +1 more source

Bayesian hierarchical model for transcriptional module discovery by jointly modeling gene expression and ChIP-chip data

BMC Bioinformatics, 2007
Background Transcriptional modules (TM) consist of groups of co-regulated genes and transcription factors (TF) regulating their expression. Two high-throughput (HT) experimental technologies, gene expression microarrays and Chromatin Immuno-Precipitation
Sivaganesan Siva, Jessen Walter J, Liu Xiangdong, Aronow Bruce J, Medvedovic Mario   +4 more
doaj   +1 more source

An epithelial GPR35 isoform supports tumor‐associated transcriptional and metabolic phenotypes

FEBS Letters, EarlyView.
GPR35 generates two functionally distinct isoforms with previously unresolved roles. GPR35‐short mediates immune‐cell chemotaxis, while GPR35‐long is enriched in colorectal cancer epithelium, where it supports increased metabolism, proliferation, and tumor‐associated transcriptional programs.
Jørgen D. Rønneberg, Martine Hjeltnes, Josephine Krieger, Joshua E. Elias, Maria Stensland, Kristian Holm, Xiaojun Jiang, Chuki Khangsar, Tuula A. Nyman, Arthur Kaser, Johannes R. Hov, Tom H. Karlsen, Nicole C. Kaneider, Frode L. Jahnsen, Georg Schneditz   +14 more
wiley   +1 more source

Highly Sensitive and Miniaturized Fluorescence Detection System with an Autonomous Capillary Fluid Manipulation Chip

Micromachines, 2012
This paper presents a novel, highly sensitive and ultra-small fluorescent detection system, including an autonomous capillary fluid manipulation chip. The optical detector integrates a LED light source, all necessary optical components, and a photodiode ...
Ji Fang, Mingjin Yao, Girish Shah
doaj   +1 more source

Structure‐forward targeting of claudins with synthetic binders

FEBS Letters, EarlyView.
Claudins form the paracellular barriers between epithelial and endothelial tissues at tight junctions and are targets for molecular binders with the goal of modulating barrier permeability. Claudin‐binding molecules are relevant in drug delivery or in altering claudin interactions with disease‐causing proteins.
Alex J. Vecchio
wiley   +1 more source

Leveraging Modularity of Chiplets to Form a 4×4 Automotive FMCW-Radar in an eWLB-Package

IEEE Journal of Microwaves
Dividing a System on Chip (SoC) into multiple smaller chiplets and embedding them into a single package has gained significant traction in recent years through more widespread adoption in digital circuitry.
Pascal Stadler, Jan Schoepfel, Lars Kleditsch, Christian Geissler, Reinhold Herschel, Ram K. Arumugam, Patrick Wallrath, Klaus Aufinger, Steffen Paul, Nils Pohl, Tobias T. Braun   +10 more
doaj   +1 more source

Peripheral lysosomes recruit PLEKHG3 to focal adhesions and restrain protrusion dynamics

FEBS Letters, EarlyView.
Proximity‐dependent labeling at the LAMTOR complex revealed the Rho GEF PLEKHG3 as a lysosome‐proximal protein directing the study toward the influence of lysosome positioning on actin dynamics and cell motility. We show that PLEKHG3 colocalizes with lysosomes at focal adhesion sites and observe that forced peripheral dispersion of lysosomes hinders ...
Rainer Ettelt, Ana‐Maria Sandru, Georg Vucak, Sebastian Didusch, Biljana Riemelmoser, Karin Ehrenreiter, Markus Hartl, Lukas A. Huber, Manuela Baccarini   +8 more
wiley   +1 more source

Bioinspired thermally conducting packaging for heat management of high performance electronic chips

Communications Engineering
Conventional electronic chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant.
Huawei Wang, Pengfei Bai, He Cui, Xiaotong Zhang, Yifan Tang, Shaoyu Liang, Shixiao Li, Guofu Zhou   +7 more
doaj   +1 more source

The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging

Micromachines
With the development of high-density integrated chips, low-k dielectric materials are used in the back end of line (BEOL) to reduce signal delay.
Dejian Li, Bofu Li, Shunfeng Han, Dameng Li, Baobin Yang, Baoliang Gong, Zhangzhang Zhang, Chang Yu, Pei Chen   +8 more
doaj   +1 more source