Results 201 to 210 of about 54,421 (264)

From stem cells to somites: Revealing genetic and exogenous factors of human embryogenesis. [PDF]

Stem Cell Reports
Alejo-Vinogradova MT, Strøm YE, Lamers LA, Chang YW, Hendriksen MJ, Moosajee M, Vermeulen M, Stelloo S.   +7 more
europepmc   +1 more source

Nucleation-dependent propagation of Polycomb modifications emerges during the <i>Drosophila</i> maternal to zygotic transition. [PDF]

Elife
Gonzaga-Saavedra N, Degen EA, Soluri IV, Croslyn C, Blythe SA.   +4 more
europepmc   +1 more source

Ultralow-Dispersion Silicon THz Photonic Crystal Interconnects for Multichannel Datalinks. [PDF]

Adv Mater
Navaratna N, Tan TC, Szriftgiser P, Ducournau G, Singh R.   +4 more
europepmc   +1 more source

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Wafer level packaging of a tape flip-chip chip scale packages

Microelectronics Reliability, 2001
Abstract The advent of chip scale packages (CSPs) within the semiconductor community has led to the development of wafer scale assembly (WSA) or wafer level packaging (WLP) manufacturing in order to raise assembly efficiencies and lower operating costs.
Greg Hotchkiss, Gonzalo Amador, Darvin Edwards, Paul Hundt, Les Stark, Roger Stierman, Gail Heinen   +6 more
openaire   +2 more sources

Tomorrow’s Packaging – Chip Scale Packaging vs Flip Chip

Microelectronics International, 1997
The electronics packaging industry is debating whether CSP, Chip Scale Packaging, or flip chip is going to become the major alternative for future products. The user wants more functionality and portability at an ever increasing speed and the need for denser packaging is becoming urgent.
K. Boustedt, E.J. Vardaman
openaire   +1 more source

Chip scale packaging and redistribution

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153), 2002
Packaging of electronic components is in a transitional phase due to the relentless progress of transistor integration that is going on in the semiconductor environment. While all manufacturers may want to transition directly to flip chip, for a number of reasons, that may not always be possible.
P.A. Magill, W.C. Machon, G.A. Rinne, J.D. Mis, J.W. Baggs   +4 more
openaire   +1 more source

Chip scale packaging reliability

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458), 2002
The introduction of underfill in flip chip packaging gave solder interconnect technology an unforeseen mechanical robustness and increased flip chip solder fatigue resistance. Derivatives from this technology (e.g. PBGA, CBGA, CSP, etc.) have been developed in recent years.
H. Quinones, A. Babiarz
openaire   +1 more source

Chip-scale packaging

IEEE Spectrum, 1997
Uniting the advantages of bare die and mainstream packaging, these minimal IC supports are racing to the aid of portable yet powerful products. Rigorously defined, the perimeter of such a package is no more than 1.2 times the perimeter of the die it contains, so that few other IC packages are any smaller. This reduction in size is the key driver of the
openaire   +1 more source

A novel joint-in-via, flip-chip chip-scale package

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004
It is believed that the slower-than-expected adoption of flip-chip (FC) packages is due to the lagging advancement in substrate designs and technologies with front-end processes. This lag has also resulted in the need for a costly redistribution layer (RDL), which fans out the die pads to meet the substrate design rule.
T.K. Lee, S. Zhang, C.C. Wong, A.C. Tan
openaire   +1 more source