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Reliability of Wafer Level Chip Scale Packages
Microelectronics Reliability, 2014Abstract This paper describes applied reliability for semiconductor components in Wafer Level Chip Scale Packages (CSP). To develop and qualify reliable products, the failure mechanism driven approach is to be followed instead of the stress test driven one.
R. T. H. Rongen +5 more
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2001
In the last three decades, many innovative microelectronics packaging and interconnection-related technologies, such as tape automated bonding (TAB), flip chip, multi-chip modules (MCMs), and ball grid arrays (BGAs), have been developed, applied, and demonstrated in a variety of electronic products.
Puligandla Viswanadham +2 more
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In the last three decades, many innovative microelectronics packaging and interconnection-related technologies, such as tape automated bonding (TAB), flip chip, multi-chip modules (MCMs), and ball grid arrays (BGAs), have been developed, applied, and demonstrated in a variety of electronic products.
Puligandla Viswanadham +2 more
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Thermal Solutions for Multi-chip Chip Scale Packages
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008With the need for more functionality smaller form factor and lower cost products in electronic industry, various structures of chip scale packages (CSP) and multi-chip 3D packages have become more and popular. Compared to single die package, the multiple chips package can accommodate with multi-functional devices and increase the memory capacity within
M. W. Chen +3 more
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Chip scale package: "a lightly dressed LSI chip"
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995A new flip-chip-like package named chip scale package (CSP) has been developed. It is constructed of LSI chips, thin resin coats, and electrode balls, having no leadframe nor any bonding wires. Wiring conductor patterns were used for electrical connection between internal pads on the die and external electrode balls. Also the transfer-bumping technique
M. Yasunaga +5 more
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Chip scale packaging using chip-on-flex technology
1997 Proceedings 47th Electronic Components and Technology Conference, 2002An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each.
R. Fillion +3 more
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Microelectronics Reliability, 2000
Abstract Availability of board solder joint reliability information is critical to the wider implementation of chip scale packages (CSPs). The JPL-led CSP consortia of enterprises representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of CSPs for variety of ...
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Abstract Availability of board solder joint reliability information is critical to the wider implementation of chip scale packages (CSPs). The JPL-led CSP consortia of enterprises representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of CSPs for variety of ...
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Reliability modeling of chip scale packages
Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146), 2002The chip-scale package (CSP) is an increasingly popular small size, high performance package. The advantages of such a package are that it offers considerable space savings over full-sized BGA or peripherally leaded devices while maintaining the convenience and die protection of a packaged device.
J.M. Pitarresi +3 more
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Cost analysis of chip scale packaging
Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium, 2002This paper documents a chip scale package (CSP) cost analysis using SEMATECH's Cost/Resource Model (CRM). The intent of the analysis was to compare costs between CSPs and conventional package technologies such as the thin small outline package (TSOP) and ball grid array (BGA) to determine whether CSP is a viable packaging technology.
null Lo-Soun Su, M. Louis, C. Reber
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1997 Proceedings 47th Electronic Components and Technology Conference, 2002
A chip-scale package has been developed comprising an area-array bond pad die, solder bumped and mounted on a metallic frame. The die is fully encapsulated by an epoxy molding compound. Openings in the encapsulation are created corresponding to the bumps on the die.
Y.C. Teo +6 more
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A chip-scale package has been developed comprising an area-array bond pad die, solder bumped and mounted on a metallic frame. The die is fully encapsulated by an epoxy molding compound. Openings in the encapsulation are created corresponding to the bumps on the die.
Y.C. Teo +6 more
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Applications and Technology Trends for Chip Scale and Near Chip Scale Packages
Specialized and Legacy Electronics Manufacturing Conferences, 1998ABSTRACT One of the hottest topics in electronics assembly today is small format packaging. The terms Chip Scale Package (CSP) or Near Chip Scale Package (NCSP) denote a variety of package types whose goal is to minimize the size, height, and weight of the package while satisfying the other demands placed on the package by its ...
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