Results 221 to 230 of about 54,421 (264)

Cost issues for chip scale packaging

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium, 2002
The IC industry amounted to $140 billion worldwide in 1996. As the consumer and portable electronics portion of this market grows, so will. The demand for component packaging that meets higher density requirements. Chip scale packaging (CSP) addresses this need, but many technology variations exist, creating confusion among potential users about which ...
A.T. Singer, J.F. Wzorek
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Development of chip scale package for DRAM

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330), 2003
In order to assemble a chip scale package (CSP), a die with centralized bonding pads was mounted on a printed circuit board (PCB) using adhesive film, and was wire-bonded through a slot formed along the PCB center area, followed by encapsulation. After solder ball attachment, a PCB strip was divided into individual packages by punching.
T.J. Cho, E.C. Ahn, J.H. Lyu, M.G. Chung, S.Y. Oh   +4 more
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Chip scale packaging for memory devices

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 2002
A low cost, high reliability chip scale package has been developed for memory devices. The developed CSP can be applied to center pad type devices such as DRAM and to peripheral pad type devices such as SRAM and Flash. Reliability and high volume productivity are the main technological challenges that have to be overcome for chip scale packaging.
Y. Akiyama, A. Nishimura, I. Anjoh
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Characterization of chip scale packaging materials

Microelectronics Reliability, 1999
Abstract The mechanical stability of Chip Scale Packages (CSP) used in surface mount technology is of primary concern. The dominant issues are package warpage and solder fatigue in solder joints under cyclic loads. To address these issues, molding compound and die attach film were characterized with finite element method which employed a viscoelastic
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Chip scale packaging of a MEMS accelerometer

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004
Accelerometers fabricated with MEMS technology are widely used in automotive crash detection and vehicle dynamic control systems. Recently, there has been increased interest in the use of MEMS accelerometers in smart handheld devices. The most demanding new requirement for this application is package size.
L.E. Felton, N. Hablutzel, W.A. Webster, K.P. Harney   +3 more
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Chip-scale packaging for bioelectronic implants

2013 6th International IEEE/EMBS Conference on Neural Engineering (NER), 2013
Next generation miniaturized bioelectronic implants will require improved hermetic packaging technology to achieve the system requirements for treating complex neurological conditions. We describe herein three key advances towards enabling chip-scale packaging for bioelectronic implants.
James D. Weiland, Fred M. Kimock, Joseph E. Yehoda, Emma Gill, Ben P. Mclntosh, Patrick J. Nasiatka, Armand R. Tanguay   +6 more
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Wafer Level Chip Scale Packaging

2009
Wafer level chip scale packaging (WL-CSP) based on redistribution is the key technology which is evolving to system in package (SiP) and heterogeneous integration (HI) extended by 3-D packaging using through silicon vias (TSV). Due to further miniaturization on the chip-level WLP (wafer level package), it has been expanded to FO-WLP (fan-out WLP) which
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Chip Scale Package Design Challenges

Specialized and Legacy Electronics Manufacturing Conferences, 1998
ABSTRACT The new chip scale packages like the μBGA have advantages of small size, high reliability, ease of placement and bonding and reasonable cost. They are rapidly becoming the package of choice for flash, SRAM and DRAM memories and are being built in quantities of millions per month.
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Chip Scale Package Assembly Reliability

2001
Emerging chip scale packages (CSPs) and miniature versions of ball grid arrays (BGAs), are competing with bare die flip chip assemblies. CSP is an important miniature electronic package technology utilizing low pin counts, without the attendant handling and processing problems of low peripheral leaded packages such as thin small outline packages (TSOPs)
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Chip Scale Power Transistor Packaging

IMAPSource Proceedings
Power packaging technologies are split between discrete and integrated solutions, using a wide variety of form factors and sizes. Applications in power management, delivery, conversion and switching are all ripe for innovation. Recent advancements in packaging allow for size reduction with enhanced electrical performance and integration.
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