Results 251 to 260 of about 54,421 (264)
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Chip Scale Packaging for Modern Electronics
Soldering & Surface Mount Technology, 2003openaire +1 more source
IEEE Journal on Emerging and Selected Topics in Circuits and Systems
Partha Pande, Maurizio Palesi
exaly
Partha Pande, Maurizio Palesi
exaly
Drop failure modes of Sn–3.0Ag–0.5Cu solder joints in wafer level chip scale package
Transactions of Nonferrous Metals Society of China, 2016exaly

