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Yield Monitor Data Cleaning is Essential for Accurate Corn Grain and Silage Yield Determination
Agronomy Journal, 2019Core Ideas Corn silage and grain yield monitors collect yield data of relevance to farmers. Evaluation of quality of yield monitor data is essential, especially for silage. A data cleaning protocol, consistent across fields, farms, and years, is needed. Semi‐automation is needed for quick and consistent processing of whole‐farm data.
T.P. Kharel +6 more
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Wet cleaning process for high-yield via-last TSV formation
2016 IEEE International 3D Systems Integration Conference (3DIC), 2016The backside via-last through silicon via (TSV) process is a simple and cost-effective approach for three-dimensional integration. However, it has two problems: (1) the notching near the bottom corners of TSVs and (2) the reaction product generated by the etchback step.
Naoya Watanabe +6 more
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Influence of surface topography on the secondary electron yield of clean copper samples
Micron, 2016Secondary electron yield (SEY) due to electron impact depends strongly on surface topography. The SEY of copper samples after Ar-ion bombardment is measured in situ in a multifunctional ultrahigh vacuum system. Increasing the ion energy or duration of ion bombardment can even enlarge the SEY, though it is relatively low under moderate bombardment ...
Xiao-Chuan, Hu, Meng, Cao, Wan-Zhao, Cui
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An Integrated Energy-Yield-Cost Model to Evaluate Clean Energy Solutions for Vertical Farms
Computers and Electronics in AgricultureRamin Roshandel
exaly +3 more sources
Yield improvement in 2x node technology by introducing backside cleaning
2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2015Advanced technology nodes require low defects counts at every processing step. Wafer cleaning of the backside is a neglected area. During HVM (high volume manufacturing) for 2x nm nodes we found that cleaning the backside (BS) of the wafer have dramatic improvements in defectivity reduction and yield increase.
Niti Garg +3 more
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Yield Improvement and Cost of Test Reduction Via Automated Socket Cleaning
2020 China Semiconductor Technology International Conference (CSTIC), 2020Accurate testing of advanced devices using sockets is the primary method of assuring that the final assembled devices meet performance and reliability specifications. During any device test operation, contact is made with the device in a socket and, consequently, contamination from the package accumulates into the socket and onto the contactor surfaces.
Jerry J. Broz, Bret A. Humphrey
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Neutralization of slow multicharged ions at a clean gold surface: Total electron yields
Physical Review A, 1993Total slow-electron (${\mathit{E}}_{\mathit{e}}$\ensuremath{\le}60 eV) yields as derived from measured electron-emission statistics are presented for impact of various slow (${\mathit{v}}_{\mathit{p}}$\ensuremath{\le}${10}^{5}$ m/s) multicharged ions (${\mathrm{N}}^{5+}$,${\mathrm{N}}^{6+}$,${\mathrm{Ne}}^{5+}$--${\mathrm{Ne}}^{10+}$, ${\mathrm{Ar}}^{5+
, Kurz +4 more
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Photochemical & Photobiological Sciences, 2002
We point out that the simultaneous use of two actinometers can be useful in photochemical quantum yield determinations and illustrate this by describing a simple, general, and mathematically rigorous procedure for the determination of quantum yields of a clean photoreversible photochemical reaction of the type A + hv --> B, B + hv --> A. This is useful
Jörn, Tonne +2 more
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We point out that the simultaneous use of two actinometers can be useful in photochemical quantum yield determinations and illustrate this by describing a simple, general, and mathematically rigorous procedure for the determination of quantum yields of a clean photoreversible photochemical reaction of the type A + hv --> B, B + hv --> A. This is useful
Jörn, Tonne +2 more
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Reducing device yield fallout at wafer level test with electrohydrodynamic (EHD) cleaning
Proceedings International Test Conference 2000 (IEEE Cat. No.00CH37159), 2002Unstable contact resistance (C/sub RES/) during wafer test can significantly affect device yield, the need for reprobe, and equipment uptime. Abrasive cleaning during off-line probe card repair and maintenance is effective for reducing C/sub RES/ and removing surface contaminants from probe tips. This type of cleaning, however, shortens probe card life
Jerry J. Broz +2 more
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