Results 251 to 260 of about 2,178,884 (303)
Recyclable HFIP-mediated, atom-economical cycloisomerisation of biaryl ynamides for the sustainable synthesis of polycyclic (hetero)aromatics. [PDF]
RSC AdvSatyanarayana ANV +4 more
europepmc +1 more source
Isocyanoalkynes: Leveraging a High-Energy Interstellar Lead for Unique Multi-Bond-Forming Cascades. [PDF]
J Am Chem SocTian H, Brinck T, Absil C, Fleming FF.
europepmc +1 more source
Some of the next articles are maybe not open access.
Related searches:
Related searches:
A Case Study of Yield Improvement in a FEOL Wet Clean Process
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2019Wafers at end-of-line showed yield loss. Data Science helped to correlate to numerous clean tools/chambers at a particular step sequence in Front End of Line (FEOL). Various models and mechanisms were established. The investigation and experiments conducted are reported in this paper.
Reshmi Mitra, Zhiyong Xie
exaly +2 more sources
Optimization of Wet Clean and Its Impact on Sub-50 nm Pitch BEOL Yield
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2016In advanced technology nodes, the BEOL requires advanced patterning techniques such as triple pattering (LELELE) and side wall image transfer techniques to form metal and via structures with pitches below 50nm. This scenario has imposed increased demands on many of the semiconductor processes involved in the fabrication of integrated circuits. One such
A K M Sajjadul Islam +5 more
exaly +2 more sources
Yield Enhancement Due to Addition of Bevel Cleans at Middle of Line(MOL) Zone
Solid State Phenomena, 2018As the technology nodes become smaller and smaller the circuit dies get closer and closer to the edge of the wafer. Defects and issues on the bevel are seen to cause issues such as flaking and blocked plating on the dies at the edge of the wafer. This drastically increases the need for a clean wafer edge as the issues directly translate to yield loss ...
Tsultrim Tharchin +2 more
exaly +2 more sources
Clean Wool Yield Variation Among Regions of Rambouillet Fleeces
Journal of Animal Science, 1943Clair E Terrill
exaly +2 more sources
Reduction of photodesorption yield by oxygen discharge cleaning
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 1994The effect of a surface cleaning using oxygen Penning discharge on the photodesorption by synchrotron radiation was measured for specially extruded 99.99% aluminum chambers. Oxygen plasma produced through a high current Penning discharge removes surface contamination without giving any damage on a surface of a vacuum chamber.
N. Ota +4 more
openaire +1 more source