Results 141 to 150 of about 3,872 (182)

Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology. [PDF]

open access: yesSensors (Basel)
Du J   +9 more
europepmc   +1 more source

Robust Pixel Design Methodologies for a Vertical Avalanche Photodiode (VAPD)-Based CMOS Image Sensor. [PDF]

open access: yesSensors (Basel)
Inoue A   +24 more
europepmc   +1 more source

Color arrestor pixels for high-fidelity, high-sensitivity imaging sensors. [PDF]

open access: yesNanophotonics
Cho M   +10 more
europepmc   +1 more source

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