Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology. [PDF]
Du J +9 more
europepmc +1 more source
Accurate Real-Time Live Face Detection Using Snapshot Spectral Imaging Method. [PDF]
Wang Z +5 more
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Hybrid Organic-Si C-MOSFET Image Sensor Designed with Blue-, Green-, and Red-Sensitive Organic Photodiodes on Si C-MOSFET-Based Photo Signal Sensor Circuit. [PDF]
Jeong UH +4 more
europepmc +1 more source
Synchronous Driving Method for Stitching Pixel Arrays Based on an Adaptive Correction Technique. [PDF]
Liu S, Guo Z, Cheng X, Xu R, Yu N.
europepmc +1 more source
Parallelizing analog in-sensor visual processing with arrays of gate-tunable silicon photodetectors. [PDF]
Xiong Z +5 more
europepmc +1 more source
Ferroelectrics Hybrids: Harnessing Multifunctionality of 2D Semiconductors in the Post-Moore Era. [PDF]
Qiu H, Qian X, Qian D, Samorì P.
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Robust Pixel Design Methodologies for a Vertical Avalanche Photodiode (VAPD)-Based CMOS Image Sensor. [PDF]
Inoue A +24 more
europepmc +1 more source
Enabling point of care optical diagnostics and treatment of oral lesions in resource-limited settings: Preclinical development and evaluation of a low-cost theranostic intraoral device for image-guided photodynamic therapy. [PDF]
Khan S +11 more
europepmc +1 more source
Color arrestor pixels for high-fidelity, high-sensitivity imaging sensors. [PDF]
Cho M +10 more
europepmc +1 more source

