Results 1 to 10 of about 161,284 (157)
Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper [PDF]
Applied Sciences, 2021 Chemical–mechanical polishing (CMP) is a planarization process that utilizes chemical reactions and mechanical material removal using abrasive particles.
Seonghyun Park, Hyunseop Lee
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Velocity analysis of a lateral wave
Mongolian Geoscientist, 2023 In practice, the reflected EM signal cannot be clearly observed in GPR data due to the high water content and other reasons. However, the antenna coupling signal through the ground interface is dominated in all the GPR measurements.
Tsogtbaatar Amarsaikhan, Motoyuki Sato
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npj Flexible Electronics, 2021 Glioblastoma is a highly aggressive brain tumor, very invasive and thus difficult to eradicate with standard oncology therapies. Bioelectric treatments based on pulsed electric fields have proven to be a successful method to treat cancerous tissues ...
Marie C. Lefevre +5 more
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Sensors, 2022 For many years there has been a strong research interest in soft electronics for artificial skin applications. However, one challenge with stretchable devices is the limited availability of high performance, stretchable, electrical conductors and ...
Lionel Fliegans +4 more
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Microsystems & Nanoengineering, 2022 Transparent microelectrode arrays enable simultaneous electrical recording and optical imaging of neuronal networks in the brain. Electrodes made of the conducting polymer poly(3,4-ethylenedioxythiophene) doped with polystyrene sulfonate (PEDOT:PSS) are ...
Gerwin Dijk +3 more
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Two New Matrix Classes Related to the CMP Inverse: CMP and Co-CMP Matrices
Mathematics, 2023 This paper focuses on two new matrix classes related to the CMP inverse of a square matrix, called the CMP and co-CMP matrices. Some of their characterizations are identified based on the core-EP decomposition and subspace operations. And, we show an equivalence relationship between the co-CMP matrix set and the intersection of the core matrix set and ...
Yinlan Chen, Jiale Gao, Kezheng Zuo
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W-CMP for sub-micron inverse metallisation [PDF]
, 1997 Chemical Mechanical Polishing (CMP) of tungsten for an inverse metallisation scheme is investigated. The influence of CMP parameters on removal rate and uniformity is studied. The main effects on the removal rate are the applied pressure and the rotation
Corbach, Herman D. van +3 more
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High-order div- and quasi curl-conforming basis functions for calderon multiplicative preconditioning of the EFIE [PDF]
, 2011 A new high-order Calderon multiplicative preconditioner (HO-CMP) for the electric field integral equation (EFIE) is presented. In contrast to previous CMPs, the proposed preconditioner allows for high-order surface representations and current expansions ...
Andriulli, Francesco P +3 more
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Consumption Optimization in CMP Processes
Journal of Advanced Mechanical Design, Systems, and Manufacturing, 2009 This paper introduces a method of minimizing consumption in order to reduce the running cost of oxide-film CMP processes. Three types of consumables are administrated and replaced based on control limits in use time and monitored removal rate.
Toshihiro MORISAWA +3 more
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Inhibition of CMP-sialic acid transport by endogenous 5-methyl CMP [PDF]
PLOS ONE, 2020 AbstractNucleotide-sugar transporters (NSTs) transport nucleotide-sugar conjugates into the Golgi lumen where they are then used in the synthesis of glycans. We previously reported crystal structures of a mammalian NST, the CMP-sialic acid transporter (CST) (Ahuja and Whorton 2019).
Shivani Ahuja +3 more
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