Results 261 to 270 of about 63,222 (303)
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Surface Preparation in CMP Process; Post CMP Cleaning and Defects
ECS Transactions, 2007Defects due to CMP processes should be removed for next processing step. The zeta potential of slurry particle and substrate has been considered to be a critical factor in terms of particle adhesion and removal. The fundamental research such as the calculation interaction force based on DLVO theory and the measurement of adhesion forces by AFM between ...
Jin-Goo Park, Tae-Gon Kim
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CMP-KDO synthetase: Overproduction and application to the synthesis of CMP-KDO and analogs
Bioorganic & Medicinal Chemistry, 1995CTP:CMP-3-deoxy-manno-octulosonate cytidylyltransferase (CMP-KDO synthetase, EC 2.7.7.38) has been cloned and overexpressed in Escherichia coli. The structure gene was amplified from the total DNA of E. coli K-235 through the primer-directed polymerase chain reaction.
T, Sugai, C H, Lin, G J, Shen, C H, Wong
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NoC Reconfiguration for CMP Virtualization
2011 IEEE 10th International Symposium on Network Computing and Applications, 2011At NoC level, the traffic interferences can be drastically reduced by using virtualization mechanisms. An effective strategy to virtualize a NoC consists in dividing the network in different partitions, each one serving different applications and traffic flows.
Francisco Triviño +3 more
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NIR Monitoring of CMP Slurries and Post-CMP Cleaning Solutions
ECS Transactions, 2009The Near Infrared Spectroscopy (NIR) is a powerful analytical technique and process control tool, capable of providing simultaneous qualitative and quantitative information on both, solid and dissolved components of CMP slurries, as well as cleaning solutions.
Eugene Shalyt +3 more
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Functional correctness for CMP interconnects
2011 IEEE 29th International Conference on Computer Design (ICCD), 2011As transistor counts continue to scale, modern designs are transitioning towards large chip multi-processors (CMPs). In order to match the advancing performance of CMPs, on-chip interconnects are becoming increasingly complex, commonly deploying advanced network-on-chip (NoC) structures.
Rawan Abdel-Khalek +3 more
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Test Generation for CMP Designs
2010 11th International Workshop on Microprocessor Test and Verification, 2010Full-chip simulation of multicore designs is an important element in the design verification cycle of a Chip Multiprocessor (CMP). Random tests are typically applied to the Multiprocessor (MP) in order to stimulate unexercised states of the machine. Completely random MP tests generally provide inadequate coverage, especially as the core count increases.
Padmaraj Singh, David L. Landis
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News from the M in CMP - Viscosity of CMP Slurries, a Constant?
MRS Proceedings, 2003AbstractIt is well known and accepted that the viscosity of CMP-slurries has an effect on polishing results. Even though the literature on rheology recognizes that viscosity is not always constant and the slurry can show non-Newtonian behavior or even dilatant effects, all calculations have been performed with constant viscosity.However, the “real ...
W. Lortz +5 more
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MRS Bulletin, 2002
AbstractChemical–mechanical polishing, or planarization (CMP), is one of several advanced microfabrication processes that provide complementary capabilities for constructing advanced electronic devices. At the current state of the art, CMP demonstrates significant advantages due to its high degree of process flexibility, particularly in the chemical ...
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AbstractChemical–mechanical polishing, or planarization (CMP), is one of several advanced microfabrication processes that provide complementary capabilities for constructing advanced electronic devices. At the current state of the art, CMP demonstrates significant advantages due to its high degree of process flexibility, particularly in the chemical ...
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Results for the revised set of CMPs, including a CMP with no cap.
2018Performance statistics are contrasted for seven CMPs: three options for the b control parameter crossed with two options for the cap on the TAC, and further a no cap option for the b+5% option. Despite a higher average catch, the no cap option seems undesirable because of poor lower 5%ile depletion and high AAV values.
Ross-Gillespie, Andrea +1 more
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Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review
International Journal of Precision Engineering and Manufacturing - Green Technology, 2021Haedo Jeong +2 more
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