Results 111 to 120 of about 799 (161)

Dual-electrode CMUT optimization for CMUTs with uniform and non-uniform membranes

2008 IEEE Ultrasonics Symposium, 2008
In this paper, we report optimization results on dual-electrode CMUTs with uniform and non-uniform membranes. The electromechanical coupling coefficient (k2) is both simulated and experimentally measured for conventional and dual-electrode CMUTs. The electromechanical coupling coefficient (k2) of 0.82 at 90% of collapse voltage as well as 136% 3dB one ...
Değertekin, F Levent   +3 more
openaire   +2 more sources

Fabrication of gap-optimized CMUT

IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 2002
A recently introduced set up of capacitive micromachined ultrasonic transducers (cMUT) combines a conductive membrane above a structured sacrificial layer. All previous approaches either require an additional metallic electrode or do not possess a structured sacrificial layer and, consequently, may make exact adjustment of the membrane dimensions ...
Oliver, Ahrens   +4 more
openaire   +2 more sources

Characterization of cMUTs in rarefied gases

IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 2007
The performance of capacitive micromachined ultrasonic transducers (cMUTs) was investigated at low pressures in various gases such as air, carbon dioxide, and helium. The aim was to replicate the pressure conditions likely to meet on the surface of other planets such as Mars, where ultrasonic wind velocity measurements might be possible.
Lee A J, Davis   +2 more
openaire   +2 more sources

Grooved Backing Structure for CMUTs

IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 2013
Capacitive micromachined ultrasonic transducers (CMUTs) manufactured on silicon substrates need an acoustic backing to suppress substrate ringing when such transducers are in operation. The acoustic backing most often used for ultrasound transducers is a composite of epoxy and tungsten powder. To absorb the acoustic energy, the backing of a CMUT should
Kamal Raj, Chapagain, Arne, Rønnekleiv
openaire   +2 more sources

Embedded sacrificial layers for CMUT fabrication [PDF]

open access: possible2015 IEEE SENSORS, 2015
Capacitive Micromachined Ultrasonic Transducers (CMUTs) are generally fabricated either by conventional sacrificial release process or by wafer bonding technique. In the former, sacrificial layers are patterned with deposited materials on the substrate.
Bozkurt, Ayhan   +3 more
openaire   +2 more sources

Application of CMUT as immunosensor

2013 IEEE International Ultrasonics Symposium (IUS), 2013
Surface biofunctionalization of capacitive micromachined ultrasonic transducer (CMUT) based sensor can develop non-informative stress and elasticity, which are distorting sensor readings related with the mass of established immune complex. The prototype sensor calibration function, using polimethylmetacrylate (PMMA) films from 7 to 100 nm, was ...
Dovydas Barauskas   +5 more
openaire   +1 more source

Multi-row linear cMUT array using cMUTs and multiplexing electronics

2009 IEEE International Ultrasonics Symposium, 2009
A large area reconfigurable imaging array for research purposes is being developed with co-integrated cMUTs and control electronics. The goal is a 2.5cm 2D tileable module with ≫16,000 transducer sub-elements spaced at a pitch of 185um in X and Y dimensions.
Robert Wodnicki   +9 more
openaire   +1 more source

Capacitance measurements of an SOI based CMUT

2013 IEEE 4th Latin American Symposium on Circuits and Systems (LASCAS), 2013
Capacitance measurement results for an SOI based CMUT are presented. Measurement results show that the variation in capacitance change as a function of both DC bias and AC excitation is considerably higher than analytically calculated values. Investigation shows that this deviation in capacitance from analytically calculated values is due to the ...
Jonathan Hernandez   +2 more
openaire   +1 more source

CMUT characterization by interferometric and electric measurements

IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 2009
Capacitive micromachined ultrasonic transducers (CMUTs) with 5.7 mum radius, realized by wafer bonding, have been characterized by both optical and electrical measurements. These measurements are performed by our heterodyne interferometer and a network analyzer, respectively. The results from this article will be used to improve the fabrication of next-
Hanne, Martinussen   +3 more
openaire   +2 more sources

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