Results 121 to 130 of about 126,971 (263)
Curvature pinching theorem for minimal surfaces with constant Kaehler angle in complex projective spaces [PDF]
, 1991 Takashi Ogata
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Advanced Engineering Materials, EarlyView.This study presents a 3D representative volume element‐based simulation approach to predict mesoscopic residual stress and strain fields in silicon solid solution‐strengthened ductile cast iron. By modeling phase transformation kinetics with an enhanced Johnson–Mehl–Avrami–Kolmogorov model, the effects of varying cooling rates on residual stresses are ...
Lutz Horbach +6 more
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A Unifying Framework for Complex-Valued Eigenfunctions via The Cartan Embedding. [PDF]
J Geom AnalGudmundsson S, Lindström A.
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Complete Kähler manifolds with zero Ricci curvature and Kobayashi-Ochiai's characterizationof complex projective spaces [PDF]
, 1993 Ryoichi Kobayashi
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Development of Aluminum Scandium Alloys for Hydrogen Storage Valves
Advanced Engineering Materials, EarlyView.Different aluminum alloy series and various aluminum‐scandium alloys with differing Sc and Zr levels are evaluated for use in hydrogen storage valve production. The alloys undergo hardness testing, optical microscopy, and tensile strength analysis, with hardening behavior studied under varying conditions.
Francisco García‐Moreno +4 more
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Subword Complexes and Kalai's Conjecture on Reconstruction of Spheres. [PDF]
Discrete Comput GeomCeballos C, Doolittle J.
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Totally real submanifolds in a complex projective space [PDF]
, 1999 Ximin Liu
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Advanced Engineering Materials, EarlyView.A multimaterial approach is introduced to improve upon auxetic structures by combining two different polymers into the same reentrant honeycomb structure via additive manufacturing. The deformation behavior as well as the resulting Poisson's ratio are thereby improved significantly.
Alexander Engel +2 more
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Splitting unramified Brauer classes by abelian torsors and the period-index problem. [PDF]
Math AnnHuybrechts D, Mattei D.
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Advanced Engineering Materials, EarlyView.This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan +5 more
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