Results 91 to 100 of about 128,236 (311)

Temperature mapping of operating nanoscale devices by scanning probe thermometry

open access: yesNature Communications, 2016
Thermometry using scanning probe techniques allows for the thermal imaging and characterization of devices with nanoscale resolution, however can be hindered by contact-related artefacts.
Fabian Menges   +5 more
doaj   +1 more source

Designing Polymer Nanocomposites for X‐Ray Shielding: Mechanisms, Architectures, and Scalable Processing

open access: yesAdvanced Engineering Materials, EarlyView.
This review highlights advances in lightweight, lead‐free polymer nanocomposites for diagnostic X‐ray shielding. By linking filler chemistry, dispersion, architecture, and photon interaction mechanisms, it establishes structure–performance relationships guiding material design.
Aklilu G. Messele   +2 more
wiley   +1 more source

Thermal contact resistance [PDF]

open access: yes, 1966
This work deals with phenomena of thermal resistance for metallic surfaces in contact. The main concern of the work is to develop reliable and practical methods for prediction of the thermal contact resistance for various types of surface characteristics
Rohsenow, W. M.   +2 more
core  

A Dislocation Perspective on Strength and Toughness in Ceramics

open access: yesAdvanced Engineering Materials, EarlyView.
Dislocations in ceramics enjoy a long but yet under‐appreciated history. The three research waves for dislocations in ceramics highlight the topic evolution over the last 90 years. This review focuses on the impact of dislocation on strength and toughness in ceramics.
Xufei Fang
wiley   +1 more source

Pressure-Dependent Thermal Network Model for Press-Pack Power Modules with Prognostics of Mechanical Status

open access: yesCSEE Journal of Power and Energy Systems
The press-pack power module with multi-chip layout has drawn increasing attention from industry and academia with its thermal analysis becoming an essential issue.
Yao Chang   +7 more
doaj   +1 more source

Influence of Si Content and Milling Duration on the Microstructure and Mechanical–Tribological Properties of AlCoCrFeNiSi High‐Entropy Alloys

open access: yesAdvanced Engineering Materials, EarlyView.
Si‐doped AlCoCrFeNi high‐entropy alloys are synthesized by mechanical alloying to reveal the effect of Si content and milling time on phase evolution, microstructural refinement, and tribological behavior. A transition from FCC to BCC structure, significant grain refinement, and enhanced hardness and wear resistance are achieved, with the 4 at% Si ...
Mustafa Okumuş   +2 more
wiley   +1 more source

An Experimental Study on Heat Conduction and Thermal Contact Resistance for the AlN Flake

open access: yesAdvances in Materials Science and Engineering, 2013
The electrical technology has been a fast development over the past decades. Moreover, the tendency of microelements and dense division multiplex is significantly for the electrical industries.
Huann-Ming Chou   +2 more
doaj   +1 more source

Quantum limits of ballistic electrical and thermal resistances of semiconductors [PDF]

open access: yesAIP Advances
The importance of electrical contact resistance and thermal boundary resistance has increased dramatically as devices are scaled to atomic limits. The use of a rich range of materials with various bandstructures (e.g., parabolic and conical) and in ...
Alice Ho   +4 more
doaj   +1 more source

Thermal contact resistance across a copper-silicon interface [PDF]

open access: yes, 1997
The issue of thermal contact resistance across metallic interfaces has been investigated for many situations over the past several decades. The application in the present case is contact cooling of high heat load optical substrates.
Worek, W. M.   +4 more
core   +1 more source

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