Results 101 to 110 of about 5,609,671 (298)

An Experimental Study on Heat Conduction and Thermal Contact Resistance for the AlN Flake

open access: yesAdvances in Materials Science and Engineering, 2013
The electrical technology has been a fast development over the past decades. Moreover, the tendency of microelements and dense division multiplex is significantly for the electrical industries.
Huann-Ming Chou   +2 more
doaj   +1 more source

FastNano Liquid: An Automated Platform for Small‐Angle X‐ray Scattering‐Based Materials Discovery

open access: yesAdvanced Engineering Materials, EarlyView.
We present FastNano Liquid, an automated small‐ and wide‐angle X‐ray scattering platform for the combined synthesis and characterization of (nano)materials. The platform is coupled to varied reactor workflows for both in situ studies of reaction kinetics and ex situ screening of synthesis conditions to support machine learning‐guided exploration ...
Pierre‐Baptiste Flandrin   +16 more
wiley   +1 more source

Thermal Contact Resistance of Polymer Interfaces [PDF]

open access: yes, 2006
In this study an experimental program was carried out to determine the thermal contact resistance at polymer interfaces. Specifically, a polycarbonate to stainless steel interface along with a polycarbonate to polycarbonate interface were ...
Gibbins, Josh
core  

Flexible thin-film thermal sensor for estimating thermal transport properties designed for biomaterial applications

open access: yesScientific Reports
This study develops a flexible thin-film thermal sensor for estimating the key thermal transport properties of biomaterials, namely thermal conductivity, volumetric heat capacity, and thermal contact resistance.
Takahiro Okabe   +3 more
doaj   +1 more source

Electromagnetic−Thermo−Mechanical Coupling Analysis of Armature−Rail Contact Behavior in Electromagnetic Railgun

open access: yesModelling
To address the critical role of armature–rail contact in electromagnetic railguns, a comprehensive electromagnetic–thermal–mechanical coupled model is developed.
Dongke Li   +4 more
doaj   +1 more source

Effect of Cu and CuP Additions on the Microstructure and Nanoindentation‐Based Fracture Behavior of CoNiAlSi Ferromagnetic Shape Memory Alloys

open access: yesAdvanced Engineering Materials, EarlyView.
Cu and combined Cu–P microalloying refine the microstructure and enhance the nanoindentation‐derived fracture resistance of CoNiAlSi ferromagnetic shape memory alloys without suppressing the martensitic transformation. Comparative SEM, DSC, and nanoindentation results reveal that the CuP‐containing alloy provides the most balanced response, achieving ...
Mehmet Demir
wiley   +1 more source

Cryogenic Deformation Behavior of TiAl and Insights Into Embrittlement After High‐Temperature Exposure Combined With Secondary Ion Mass Spectroscopy of Near Surface Chemistry

open access: yesAdvanced Engineering Materials, EarlyView.
Near‐surface deuterium enrichment profiles for different microstructural types of TiAl after exposure at 700 °C in a heavy water‐containing environment. The deuterium levels are significantly higher than expected from natural occurrence, indicating that the heavy water dissociated during the exposure treatment and entered the specimens.
Jonathan D. H. Paul   +5 more
wiley   +1 more source

Enhanced effective thermal conductivity of polymer composites using core-shell fillers

open access: yeseXPRESS Polymer Letters
Core-shell fillers represent an innovative class of fillers distinct from conventional fillers. This study explores the combined effects of filler contact, thermal contact resistance at the shell-matrix interface (R*s-m) and shell-core interface (R*c-s),
Zheng Ling   +3 more
doaj   +1 more source

Enhancement of the Through‐Thickness Electrical Conductivity of Carbon‐Fiber‐Reinforced Plastics Using Large Graphite Particles

open access: yesAdvanced Engineering Materials, EarlyView.
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe   +6 more
wiley   +1 more source

The Role of Ultra‐Thin Passive Films and Organic Adsorbates on Aluminum Chips for a Friction‐Induced Solid‐State Recycling Process

open access: yesAdvanced Engineering Materials, EarlyView.
Despite benefits to storage stability and handleability of aluminum scrap, octadecyl phosphonic acid (ODPA) SAMs reduce the tensile strength of wires produced using friction‐induced recycling. Etching and methyl diphosphonic acid (MDPA) coatings, however, have little effect.
Timothy D. Goller   +3 more
wiley   +1 more source

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