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Advances in thermal contact resistance studies
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 2022The demand for accurate Thermal Contact Resistance analysis and prediction continues to increase with the advancement of technology. In applications such as manufacturing, it is beneficial to understand the Thermal Contact resistance between the workpiece and tool, or between the tool and debris or shavings to accurately predict the tool wear rate.
Rabelani Dennis Murwamadala +1 more
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On the electrical and thermal contact resistance of metal foam
International Journal of Heat and Mass Transfer, 2014 This paper addresses the electrical and thermal contact resistance in metal foam-graphite assemblies considered for use in next generation air-cooled fuel cells as replacements of currently available water-cooled ones.
Thomas Fiedler +2 more
exaly +2 more sources
Thermal resistance of metallic contacts
International Journal of Heat and Mass Transfer, 1964Abstract A calculation method for thermal resistance of a contact between two rough metal surfaces with different compressing forces and quality of finishing is considered. The results of analytical calculation are correlated with experimental data.
Yu.P. Shlykov, Ye.A. Ganin
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CAE/CAD and Thermal Management Issues in Electronic Systems, 1997
Abstract The thermal contact resistance at the interface of a bolted joint was investigated analytically, experimentally and numerically. Consideration was restricted to an ideal two-plate model for which the interface was perfectly flat. The two bolted plates made circular contact under uniform axisymmetric normal loading. The effect of
Chang J. Park, Deborah A. Kaminski
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Abstract The thermal contact resistance at the interface of a bolted joint was investigated analytically, experimentally and numerically. Consideration was restricted to an ideal two-plate model for which the interface was perfectly flat. The two bolted plates made circular contact under uniform axisymmetric normal loading. The effect of
Chang J. Park, Deborah A. Kaminski
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Influence of thermal contact resistance on thermal impedance of microelectronic structures
Microelectronics Reliability, 2007Abstract The thermal impedance Z th (j ω ) has been calculated numerically for a silicon chip glued on a ceramic substrate. The non perfect thermal contact is taken into account by modelling the chip-substrate interface as a thermal contact resistance r c . If Z th is represented as a Nyquist plot, mainly two circular arcs are observed.
Bjorn Vermeersch, Gilbert De Mey
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Transient thermal contact resistance
International Journal of Heat and Mass Transfer, 1991Abstract The short-time asymptotic solution for the heat flow between two similar bodies placed in contact has recently been given by Barber. The long-time asymptotic solution is given here: it has exactly the same form as the short-time asymptote Q KT 0 = C 0 + C 1 √(παt) but, in general, has different coefficients.
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Thermal resistance (Rth) enhancement by optimizing TO package thermal contact
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2009The trend for package size shrinkage has created challenges to thermal performance while improving the cost performance. When TO package size shrink by minimizing the leadframe copper usage, challenges in package warpage and thermal contact become great.
Lee Teck Sim, Darakorn Sae Le
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Effects of nanosized contact spots on thermal contact resistance
Journal of Applied Physics, 2008We investigate the effects of nanosized contact spots on the thermal contact resistance (TCR) in multiscale contacts. As the contact size decreases below the phonon mean free path, the thermal conductivity varies with the size of the contact and is not the same as its bulk counterpart.
Sangyoung Lee +2 more
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Thermal Contact Resistance in Vacuum
Journal of Heat Transfer, 1967Similar or dissimilar materials thermal contact resistance in vacuum with negligible film effect, obtaining constriction ...
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Thermal Contact Resistance at the Nb-Cu Interface
2015Niobium thin film sputtered copper cavities are strongly limited for the application in high field accelerators by the unsolved “Q-slope” problem. In the present paper, we examine the different contributions of the niobium film, the copper substrate, the Helium-Copper interface and the Niobium-Copper Interface, proposing the hypothesis that main cause ...
V. Palmieri, R. Vaglio
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