Results 231 to 240 of about 8,697,543 (404)

A survey of medical school continuing education programs

open access: bronze, 1977
J L Mason, Murray M. Kappelman
openalex   +1 more source

Successful Continuing Education Programming through Consumer input [PDF]

open access: bronze, 1979
Hester I. Thurston   +2 more
openalex   +1 more source

Static and Dynamic Behavior of Novel Y‐Shaped Sandwich Beams Subjected to Compressive Loadings: Integration of Supervised Learning and Experimentation

open access: yesAdvanced Engineering Materials, EarlyView.
In this study, the mechanical response of Y‐shaped core sandwich beams under compressive loading is investigated, using deep feed‐forward neural networks (DFNNs) for predictive modeling. The DFNN model accurately captures stress–strain behavior, influenced by design parameters and loading rates.
Ali Khalvandi   +4 more
wiley   +1 more source

3D‐Printed Architected Material for the Generation of Foam‐Based Protective Equipment

open access: yesAdvanced Engineering Materials, EarlyView.
This study investigates 3D‐printed architected structures as alternatives to traditional foams in protective gear. It focuses on customizing impact strength and damping through design and manufacturing integration. Testing shows these structures outperform conventional foams, offering enhanced customizability, lower weight, and tunable performance ...
Ali Zolfagharian   +5 more
wiley   +1 more source

Strengthening healthcare delivery in Haiti through nursing continuing education.

open access: yesInternational Nursing Review, 2015
M. Clark   +5 more
semanticscholar   +1 more source

A continuing medical education course for physicians and mid-level practitioners

open access: bronze, 1979
B D Burr   +3 more
openalex   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

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