Results 201 to 210 of about 5,668 (255)

Structural Accelerating Effect of Chloride on Copper Electrodeposition

Angewandte Chemie - International Edition, 2013
Abstract not Available.
Yuriy I, Yanson, Marcel J, Rost
exaly   +3 more sources

Copper electrodeposits in paper support

Physical Review A, 1988
Copper electrodeposits from an acid solution were grown, supported by laboratory filter paper. The paper provides good sample preservation and prevents convective solvent motion. Structural data from electron microscope and image analysis are reported. On decreasing the applied voltage, a transition from dense radial growth to open growth was observed.
, Hibbert, , Melrose
openaire   +2 more sources

Annealing of copper electrodeposits

Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 1999
The properties of electroplated copper film have been investigated as a function of annealing temperatures together with the diffusion barrier performance. Electroplated copper films on copper and tungsten seed materials were annealed from 300 to 700 °C in N2 atmosphere for grain growth study. The average grain size of the as-deposited copper films was
C. H. Seah, S. Mridha, L. H. Chan
openaire   +1 more source

Electrodeposition of nickel on copper

Journal of Chemical Education, 1986
In the classroom, one can demonstrate electroplating by the simple, fast, inexpensive, and visually interesting reaction between nickel ions and copper metal.
Joseph Manjkow, Dana Levine
openaire   +1 more source

Electrodeposition of copper on copper in the presence of dithiothreitol

Journal of Applied Electrochemistry, 1984
Studies of the -SH group effect present in dithiothreitol (DTE) with respect to morphology and electrode kinetics of copper electrodeposits on the (1 1 1) plane of a copper single crystal and polycrystalline copper from highly purified solutions of acidified copper sulphate were made.
Y. N. Sadana, S. Nageswar
openaire   +1 more source

Superconformal Electrodeposition of Copper

Electrochemical and Solid-State Letters, 2001
A model of superconformal electrodeposition is presented based on a local growth velocity that is proportional to coverage of a catalytic species at the metal/electrolyte interface. The catalyst accumulates at the interface through reaction with the electrolyte.
T. P. Moffat, D. Wheeler, W. H. Huber, D. Josell   +3 more
openaire   +1 more source

Self-affine growth of copper electrodeposits

Physical Review B, 1993
We have studied the static surface roughness of 50-μm-thick copper electrodeposits on length scales between 5 and 10 4 nm using scanning tunneling and atomic force microscopy. The surface roughness depends strongly on the concentration of organic additives in the plating solution.
, Iwasaki, , Yoshinobu
openaire   +2 more sources

Improving copper electrodeposition in the microelectronics industry

2008 58th Electronic Components and Technology Conference, 2008
Sporadic voiding within the interfacial Cu3Sn intermetallic compound (IMC) layer-sometimes referred to as ?Kirkendall voiding?-has been found to lead to degradation of solder joint reliability in board level, mechanical shock testing. It has been suggested that the voiding phenomenon is a result of the incorporation of organic impurities in the copper (
null Yihua Liu, null Liang Yin, S. Bliznakov, P. Kondos, P. Borgesen, D.W. Henderson, C. Parks, null Ju Wang, E.J. Cotts, N. Dimitrov   +9 more
openaire   +1 more source

Electrical resistance of planar copper electrodeposits

Physical Review A, 1989
Mesure directe, en courant alternatif, de la variation de la resistance electrique de depots electrolytiques de cuivre dans un support en papier, en fonction de la tension de depot.
, Melrose, , Hibbert
openaire   +2 more sources

Nitrate Reduction at Electrodeposited Copper on Copper Cathode

ECS Transactions, 2014
We report on the synthesis and characterization of low-cost copper electrodeposited on a copper substrate (Cu/Cu), and its applicability towards nitrate reduction. The surface area of Cu was increased by the electrodeposition of Cu, and at a chosen deposition potential and pH, optimum electrodeposition parameters corresponding to better catalytic ...
Kunjuvaikarar Soundararajan Rajmohan, Raghuram Chetty   +1 more
openaire   +1 more source