Results 211 to 220 of about 5,668 (255)

Selective Copper Electrodeposition to a 3D Copper Nanostructure

ECS Meeting Abstracts, 2016
Introduction Three-dimensional (3D) copper nanostructures are expected to be applied as current collectors for lithium ion battery anodes due to their high electrical conductivity and large specific surface area. The production of 3D copper nanostructures usually requires complicated fabrication steps; however, we have developed a ...
Yuma Kobayashi, Susumu Arai
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Electrodeposition of Copper from Sulfate Electrolytes: Effects of Thiourea on Resistivity and Electrodeposition Mechanism of Copper

Electrochemical and Solid-State Letters, 2001
Copper was electrodeposited from sulfate bath onto copper substrate over silicon wafer with titanium adhesive film and the resistivity was measured using a four-point probe method. The measured resistivities increased as thiourea concentration increased from to and as the current density was increased from 1 to 50 mA/cm2.
V. S. Donepudi, Rajeev Venkatachalapathy, Peter O. Ozemoyah, C. S. Johnson, Jai Prakash   +4 more
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Characterization of dislocations in copper electrodeposits

Journal of Materials Science, 2000
Copper electrodeposits with the [111] orientation were obtained from a copper sulfate bath consisting of 280 g/l CuSO45H2O and 80 g/l H2SO4 at 30°C. The cathode current density was 900 to 1300 A/m2. Dislocations in the electrodeposits were characterized using transmission electron microscopy. Dislocations in each of the (111) grains could be classified
Y.-S. Lee, D. N. Lee
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The stabilization of electrodeposited copper powder

Surface and Coatings Technology, 1986
Abstract Copper powder was electrodeposited from a solution containing copper sulphate and sulphuric acid. The stability of the powder, as measured by the resistance to oxidation, was assessed over a range of temperatures using a thermal balance. Similar powder was treated with an aqueous solution of benzotriazole, a specific corrosion inhibitor for ...
R. Walker, S.J. Duncan
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Anionic Impurities in Electrodeposited Copper

Transactions of the IMF, 1972
SummaryIn the electrodeposition of copper at the cathode, the anionic impurities codeposited with the metal are derived from the plating solution. The variation of these impurities has been studied as a function of current density, temperature, pH, and composition of the bath.
R. D. Srivastava, S. Kumar
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Electrodeposition of copper in the presence of cadmium

Electrochimica Acta, 1979
Abstract A study was made of the effect of cadmium concentration on the process of copper electrocrystallization from an ethylenediamine electrolyte on the (111) crystallographic plane of a copper single crystal. It was shown that a relation exists between superpolarization and depolarization of deposition of Cu-Cd alloy components, and cadmium ...
A. Budniok, J. Gala, I. Pluta
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Electrodeposition of copper by IMPC method

Journal of Central South University of Technology, 2000
In order to develop an energy-saving electrodeposition process of copper, the electrodeposition of copper in copper sulfate solution by the ion-exchange membrane primary cell (IMPC) method has been studied. The experiments were carried out in an ion-exchange membrane primary cell with dimensions of 200 mm in length, 52 mm in width and 90 mm in height ...
Kang-gen Zhou, Qing-gang Li, Qi-xiu Zhang   +2 more
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Fractal electrodeposits of zinc and copper

Journal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1990
Abstract Experiments on the electrodeposition of zinc and copper from aqueous solutions of ZnSO 4 and CuSO 4 are reported. The two-dimensional deposits were grown from a line electrode at small ionic concentration (≅0.1 M) and low voltages (10 V). They show fractal characteristics similar to those of diffusion-limited aggregation (DLA) patterns. In
Francesc Sagués, Francesc Mas, Marta Vilarrasa, Josep M. Costa   +3 more
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The structure of electrodeposited copper—I

Electrochimica Acta, 1960
S.C. Barnes, G.G. Storey, H.J. Pick
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Gelatin-halide interaction in copper electrodeposition

1951
Winkler, C. A. (Supervisor)
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