Results 231 to 240 of about 751,941 (280)

Superconformal Electrodeposition of Copper

Electrochemical and Solid-State Letters, 2001
A model of superconformal electrodeposition is presented based on a local growth velocity that is proportional to coverage of a catalytic species at the metal/electrolyte interface. The catalyst accumulates at the interface through reaction with the electrolyte.
T. P. Moffat, D. Wheeler, W. H. Huber, D. Josell   +3 more
openaire   +1 more source

Self-affine growth of copper electrodeposits

Physical Review B, 1993
We have studied the static surface roughness of 50-μm-thick copper electrodeposits on length scales between 5 and 10 4 nm using scanning tunneling and atomic force microscopy. The surface roughness depends strongly on the concentration of organic additives in the plating solution.
, Iwasaki, , Yoshinobu
openaire   +2 more sources

Improving copper electrodeposition in the microelectronics industry

2008 58th Electronic Components and Technology Conference, 2008
Sporadic voiding within the interfacial Cu3Sn intermetallic compound (IMC) layer-sometimes referred to as ?Kirkendall voiding?-has been found to lead to degradation of solder joint reliability in board level, mechanical shock testing. It has been suggested that the voiding phenomenon is a result of the incorporation of organic impurities in the copper (
null Yihua Liu, null Liang Yin, S. Bliznakov, P. Kondos, P. Borgesen, D.W. Henderson, C. Parks, null Ju Wang, E.J. Cotts, N. Dimitrov   +9 more
openaire   +1 more source

Electrical resistance of planar copper electrodeposits

Physical Review A, 1989
Mesure directe, en courant alternatif, de la variation de la resistance electrique de depots electrolytiques de cuivre dans un support en papier, en fonction de la tension de depot.
, Melrose, , Hibbert
openaire   +2 more sources

Nitrate Reduction at Electrodeposited Copper on Copper Cathode

ECS Transactions, 2014
We report on the synthesis and characterization of low-cost copper electrodeposited on a copper substrate (Cu/Cu), and its applicability towards nitrate reduction. The surface area of Cu was increased by the electrodeposition of Cu, and at a chosen deposition potential and pH, optimum electrodeposition parameters corresponding to better catalytic ...
Kunjuvaikarar Soundararajan Rajmohan, Raghuram Chetty   +1 more
openaire   +1 more source

Selective Copper Electrodeposition to a 3D Copper Nanostructure

ECS Meeting Abstracts, 2016
Introduction Three-dimensional (3D) copper nanostructures are expected to be applied as current collectors for lithium ion battery anodes due to their high electrical conductivity and large specific surface area. The production of 3D copper nanostructures usually requires complicated fabrication steps; however, we have developed a ...
Yuma Kobayashi, Susumu Arai
openaire   +1 more source

Electrodeposition of Copper from Sulfate Electrolytes: Effects of Thiourea on Resistivity and Electrodeposition Mechanism of Copper

Electrochemical and Solid-State Letters, 2001
Copper was electrodeposited from sulfate bath onto copper substrate over silicon wafer with titanium adhesive film and the resistivity was measured using a four-point probe method. The measured resistivities increased as thiourea concentration increased from to and as the current density was increased from 1 to 50 mA/cm2.
V. S. Donepudi, Rajeev Venkatachalapathy, Peter O. Ozemoyah, C. S. Johnson, Jai Prakash   +4 more
openaire   +1 more source

Characterization of dislocations in copper electrodeposits

Journal of Materials Science, 2000
Copper electrodeposits with the [111] orientation were obtained from a copper sulfate bath consisting of 280 g/l CuSO45H2O and 80 g/l H2SO4 at 30°C. The cathode current density was 900 to 1300 A/m2. Dislocations in the electrodeposits were characterized using transmission electron microscopy. Dislocations in each of the (111) grains could be classified
Y.-S. Lee, D. N. Lee
openaire   +1 more source

The stabilization of electrodeposited copper powder

Surface and Coatings Technology, 1986
Abstract Copper powder was electrodeposited from a solution containing copper sulphate and sulphuric acid. The stability of the powder, as measured by the resistance to oxidation, was assessed over a range of temperatures using a thermal balance. Similar powder was treated with an aqueous solution of benzotriazole, a specific corrosion inhibitor for ...
R. Walker, S.J. Duncan
openaire   +1 more source

Fractal electrodeposits of zinc and copper

Journal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1990
Abstract Experiments on the electrodeposition of zinc and copper from aqueous solutions of ZnSO 4 and CuSO 4 are reported. The two-dimensional deposits were grown from a line electrode at small ionic concentration (≅0.1 M) and low voltages (10 V). They show fractal characteristics similar to those of diffusion-limited aggregation (DLA) patterns. In
Francesc Sagués, Francesc Mas, Marta Vilarrasa, Josep M. Costa   +3 more
openaire   +1 more source