Results 221 to 230 of about 751,941 (280)

Enhanced corrosion resistance and electrochemical stability of hybrid HA-Cu-collagen nanocoatings on Ti-6Al-4V alloy in physiological environments. [PDF]

Sci Prog
Jalalvand L, Souri A, Shanaghi A, Naseri M.   +3 more
europepmc   +1 more source

Photoswitchable Activity of Mixed Bismuth Oxide (BiO _<i>x</i> ) for Water Splitting in Neutral Media. [PDF]

ACS Omega
de Oliveira AG, Mauro AC, David MV, Rocco AM.   +3 more
europepmc   +1 more source

Electrodeposited bismuth nanomaterials as binder free and scalable catalysts for highly selective CO₂ to formate conversion.

J Mater Chem A Mater
Sihag AK, Singh YK, Kotob E, Khairunnisa SZ, Ostermann M, Guselnikova O, Valtiner M, Abdinejad M, Pichler CM.   +8 more
europepmc   +1 more source

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Copper Electrodeposition on Pyrolytic Graphite Electrodes: Effect of the Copper Salt on the Electrodeposition Process

Electrochimica Acta, 2007
The electrodeposition of copper on pyrolytic graphite from CuSO4 or Cu(NO3)2 in a 1.8 M H2SO4 aqueous solution was investigated. The Cu deposits were formed potentiostatically and characterized by electrochemical methods, scanning electron microscopy, energy dispersive X-ray and X-ray photoelectron spectroscopy.
Daniel Belanger, Ouassim Ghodbane, Lionel Roué   +2 more
exaly   +2 more sources

Structural Accelerating Effect of Chloride on Copper Electrodeposition

Angewandte Chemie - International Edition, 2013
Abstract not Available.
Yuriy I, Yanson, Marcel J, Rost
exaly   +3 more sources

Copper electrodeposits in paper support

Physical Review A, 1988
Copper electrodeposits from an acid solution were grown, supported by laboratory filter paper. The paper provides good sample preservation and prevents convective solvent motion. Structural data from electron microscope and image analysis are reported. On decreasing the applied voltage, a transition from dense radial growth to open growth was observed.
, Hibbert, , Melrose
openaire   +2 more sources

Annealing of copper electrodeposits

Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 1999
The properties of electroplated copper film have been investigated as a function of annealing temperatures together with the diffusion barrier performance. Electroplated copper films on copper and tungsten seed materials were annealed from 300 to 700 °C in N2 atmosphere for grain growth study. The average grain size of the as-deposited copper films was
C. H. Seah, S. Mridha, L. H. Chan
openaire   +1 more source

Electrodeposition of copper on copper in the presence of dithiothreitol

Journal of Applied Electrochemistry, 1984
Studies of the -SH group effect present in dithiothreitol (DTE) with respect to morphology and electrode kinetics of copper electrodeposits on the (1 1 1) plane of a copper single crystal and polycrystalline copper from highly purified solutions of acidified copper sulphate were made.
Y. N. Sadana, S. Nageswar
openaire   +1 more source

Electrodeposition of nickel on copper

Journal of Chemical Education, 1986
In the classroom, one can demonstrate electroplating by the simple, fast, inexpensive, and visually interesting reaction between nickel ions and copper metal.
Joseph Manjkow, Dana Levine
openaire   +1 more source