Results 41 to 50 of about 1,610 (259)
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová +6 more
wiley +1 more source
Simulation of Crevice and Pitting Corrosion Using the Orthogonal Collocation Method
Two dangerous forms of localized corrosion are pitting and crevice corrosion. In pitting corrosion, pits are formed as a result of differences in oxygen and ion concentration at the base of a pit compared with the surface.
A.M. Abu-Khalaf +2 more
doaj +1 more source
Mechanically-assisted crevice corrosion and its effect on materials degradation
Mechanically-assisted crevice corrosion (MACC) is a synergistic combination of wear and crevice corrosion. The major differences between tribocorrosion, fretting corrosion and MACC relate to the relative scale of motion and contact area, are clarified in
Weichen Xu +5 more
doaj +1 more source
Mechanism of Crevice Corrosion
Failure of structures and of many types of automatic equipment is often due to crevice corrosion. Differential aeration was advanced some time ago as a major cause of such attack. The present investigation was made to demonstrate other factors in the mechanism of crevice corrosion.
I. L. Rosenfeld, I. K. Marshakov
openaire +2 more sources
HEA interlayers offer a versatile route for joining high‐performance structural materials. Their compositional and structural design regulates interfacial reactions, suppresses brittle IMCs, and improves metallurgical bonding. Sandwich interlayers further integrate defect healing with precipitation strengthening, enabling improved strength–ductility ...
Lin Yuan +4 more
wiley +1 more source
The deep-sea field exposure experiment of 5A06 aluminum alloy was carried out successfully in the South China Sea with the sea depths of 1200 m, 2000 m, and 3000 m for one year.
Tigang Duan +6 more
doaj +1 more source
This perspective reframes additive manufacturing for electrical machines as a qualification‐limited materials and architecture design problem. It links process–structure–property–performance relationships to magnetic, conducting, dielectric, and thermal property windows, highlighting where AM can enable segmented magnetic circuits, permanent magnet ...
Dénes Fodor, Loránd Szabó
wiley +1 more source
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe +6 more
wiley +1 more source
Bipolar electrochemistry allows testing and analysing the crevice corrosion, pitting corrosion, passivation, general corrosion, and cathodic deposition reactions on one sample after a single experiment.
Yiqi Zhou, Dirk Lars Engelberg
doaj +1 more source
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein +4 more
wiley +1 more source

