Results 101 to 110 of about 373 (125)
3D-Printed Microfiltration Membranes via Dual-Wavelength Microstereolithography. [PDF]
ACS OmegaBazyar H +8 more
europepmc +1 more source
Analysis of Grindability and Surface Integrity in Creep-Feed Grinding of High-Strength Steels. [PDF]
Materials (Basel)Yin Y, Chen M.
europepmc +1 more source
Stretchable Curvature Sensors for Motion Capture with Bending-Stretching Coupling Deformation. [PDF]
Adv Sci (Weinh)Wang T +9 more
europepmc +1 more source
A model to predict the critical undeformed chip thickness in vibration-assisted machining of brittle materials [PDF]
International Journal of Machine Tools and Manufacture, 2013 Abstract Vibration-assisted machining (VAM) of brittle materials has been proved to be useful in improving the machining performance by significantly increasing the critical undeformed chip thickness for ductile–brittle transition. However, until now, there does not exist any viable method or model to predict the critical undeformed chip thickness in
Xinquan Zhang +2 more
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Some of the next articles are maybe not open access.
10th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Micro- and Nano-Optics, Catenary Optics, and Subwavelength Electromagnetics, 2021
Hai-Tao Yang
exaly +2 more sources
Hai-Tao Yang
exaly +2 more sources
Semiconductor Science and Technology, 2020
Abstract In order to achieve the ductile mode cutting of silicon and avoid the generation of subsurface crack damage, the undeformed chip thickness in the diamond cutting process must be controlled below the critical value. Therefore, the critical undeformed chip thickness (CUCT) for the ductile mode cutting of silicon is studied in ...
Longxu Yao +3 more
openaire +1 more source
Abstract In order to achieve the ductile mode cutting of silicon and avoid the generation of subsurface crack damage, the undeformed chip thickness in the diamond cutting process must be controlled below the critical value. Therefore, the critical undeformed chip thickness (CUCT) for the ductile mode cutting of silicon is studied in ...
Longxu Yao +3 more
openaire +1 more source
Critical undeformed chip thickness of brittle materials in single point diamond turning
International Journal of Advanced Manufacturing Technology, 2015In this work, the ultimate compression force that enables the plastic removal of brittle materials in diamond turning is initially modeled according to the theory of rigid-plastic mechanics. And subsequently, an independent oscillator model is reconstructed to calculate the microfriction force that appears at contact interface.
W. J. Zong, Z. M. Cao, C. L. He, T. Sun
exaly +2 more sources
Precision Engineering, 2016
Abstract In the last decades, micromachining has gained increased relevance as an alternative method to produce miniaturized parts for a wide range of products. Nevertheless, micromachining differs considerably from conventional machining in many aspects.
Marcelo A. Câmara +4 more
openaire +1 more source
Abstract In the last decades, micromachining has gained increased relevance as an alternative method to produce miniaturized parts for a wide range of products. Nevertheless, micromachining differs considerably from conventional machining in many aspects.
Marcelo A. Câmara +4 more
openaire +1 more source
Predictive modeling of undeformed chip thickness in ceramic grinding
International Journal of Machine Tools and Manufacture, 2012P Venkateswara Rao, Sanjay Agarwal
exaly