Results 101 to 110 of about 2,751 (148)

Critical Undeformed Chip Thickness and Cutting Pressure in Relation to Ductile Mode Cutting of KDP Crystal [PDF]

open access: yesKey Engineering Materials, 2010
Microgroove processes are carried out on Potassium Dihydrogen Phosphate (KDP) crystals of different crystalline orientation using diamond tool, the speed of groove is very low in order to avoid the influence of temperature. The main process characteristics are examined including the groove geometry, cutting forces and critical underformed chip ...
Hao Feng Chen   +4 more
semanticscholar   +5 more sources

Multiscale Predictive Modelling of Critical Undeformed Chip Thickness [PDF]

open access: yes, 2021
Predictive modelling of critical undeformed chip thickness (tc) is important for ultra-precision machining of brittle materials in a ductile mode. This paper presents a hierarchical multiscale modelling approach that is capable of quantitatively predicting the variation of tc with crystal orientation. The proposed multiscale modelling approach consists
Xuezhen Wang   +3 more
semanticscholar   +3 more sources
Some of the next articles are maybe not open access.

Critical undeformed chip thickness of brittle materials in single point diamond turning

The International Journal of Advanced Manufacturing Technology, 2015
In this work, the ultimate compression force that enables the plastic removal of brittle materials in diamond turning is initially modeled according to the theory of rigid-plastic mechanics. And subsequently, an independent oscillator model is reconstructed to calculate the microfriction force that appears at contact interface.
W. J. Zong, Z. M. Cao, C. L. He, T. Sun
exaly   +5 more sources

A predictive model of the critical undeformed chip thickness for ductile–brittle transition in nano-machining of brittle materials [PDF]

open access: yesInternational Journal of Machine Tools and Manufacture, 2013
Abstract There is a distinct transition in the mode of material removal in machining of brittle materials if the undeformed chip thickness is below a critical threshold of submicron scale. It is believed that at such small scale of material removal, the energy required to extend pre-existing flaws in the microstructure of brittle material exceeds the
Arif, M.   +3 more
semanticscholar   +3 more sources

Researching on the factors influencing the critical undeformed chip thickness of single crystal germanium

10th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Micro- and Nano-Optics, Catenary Optics, and Subwavelength Electromagnetics, 2021
Cutting in ductile mode is a prerequisite for mirror machining of single crystal brittle materials. Under the condition that the cutting thickness is less than the critical undeformed chip thickness, the single crystal brittle material is removed in ...
Shanyi Ma   +3 more
exaly   +4 more sources

Prediction of critical undeformed chip thickness for ductile mode to brittle transition in the cutting of single-crystal silicon

Semiconductor Science and Technology, 2020
Abstract In order to achieve the ductile mode cutting of silicon and avoid the generation of subsurface crack damage, the undeformed chip thickness in the diamond cutting process must be controlled below the critical value. Therefore, the critical undeformed chip thickness (CUCT) for the ductile mode cutting of silicon is studied in ...
Longxu Yao   +3 more
openaire   +2 more sources

Determination of the critical undeformed chip thickness in micromilling by means of the acoustic emission signal

Precision Engineering, 2016
Abstract In the last decades, micromachining has gained increased relevance as an alternative method to produce miniaturized parts for a wide range of products. Nevertheless, micromachining differs considerably from conventional machining in many aspects.
Marcelo A. Câmara   +4 more
openaire   +2 more sources

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