Results 111 to 120 of about 2,751 (148)

Effects of undeformed chip thickness on grinding temperature and burn-out in high-efficiency deep grinding of Inconel718 superalloys

International Journal of Advanced Manufacturing Technology, 2016
Wenfeng Ding, Jiuhua Xu, Xipeng Xu
exaly   +2 more sources

Predictive modeling of transition undeformed chip thickness in ductile-regime micro-machining of single crystal brittle materials

Journal of Materials Processing Technology, 2009
Xiaoping Li, Steven Y Liang
exaly   +2 more sources

Numerical investigation of crack initiation, propagation and suppression in robot-assisted abrasive belt grinding of zirconia ceramics via an improved chip-thickness model

, 2020
Motivated by the prevailing assisted techniques in wheel grinding of brittle and hard materials, an attempt is made in this paper to identify the feasibility of robot-assisted abrasive belt grinding of zirconia ceramics.
Dahu Zhu, Shimo Song, C. Qu, Yuanjian Lv, Chaoqun Wu   +4 more
semanticscholar   +1 more source

A predictive model of critical depth of cut for ultrasonic elliptical vibration cutting of brittle materials

International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT), 2019
Ultrasonic elliptical vibration cutting (UEVC) is attracting much attention in ultra-precision machining of brittle materials as it was found be able to increase the critical depth of cut (dc) of brittle materials.
Weihai Huang, Deping Yu, Xinquan Zhang, M. Zhang, Dongsheng Chen   +4 more
semanticscholar   +1 more source

A material removal rate prediction model for high-shear and low-pressure grinding of single crystal silicon

Journal of manufacturing science and engineering
A novel abrasive tool, based on the principle of liquid body armor, was developed in previous study. However, a material removal rate (MRR) model for the high-shear and low-pressure grinding of brittle materials using this tool has yet to be ...
Yebing Tian, Shuangchen Zhao, Guoyu Zhang, Pengzhan Wang, Shuang Liu   +4 more
semanticscholar   +1 more source

A general method for instantaneous undeformed chip thickness calculation in five-axis milling based on Boolean operations

The International Journal of Advanced Manufacturing Technology, 2021
Guochao Li, Yunlong Liu, Donghao Zhao, Lei Dai, Honggen Zhou, X. Jing   +5 more
semanticscholar   +1 more source

Ductile-regime machining model for ultrasonic elliptical vibration cutting of brittle materials

Journal of Manufacturing Processes, 2018
Ultrasonic elliptical vibration cutting (UEVC) is attracting much attention in ultra-precision machining of brittle materials as it was found be able to effectively increase the critical depth of cut (dc) of brittle materials. However, the mechanisms for
Weihai Huang, Deping Yu, Xinquan Zhang, M. Zhang, Dongsheng Chen   +4 more
semanticscholar   +1 more source

Understanding the effects of grinding speed and undeformed chip thickness on the chip formation in high-speed grinding

The International Journal of Advanced Manufacturing Technology, 2015
J. Dai, W. Ding, Liangchi Zhang, Jiu-hua Xu, H. Su   +4 more
semanticscholar   +2 more sources

An improved chip-thickness model for surface roughness prediction in robotic belt grinding considering the elastic state at contact wheel-workpiece interface

The International Journal of Advanced Manufacturing Technology, 2019
C. Qu, Yuanjian Lv, Zeyuan Yang, Xiaohu Xu, Dahu Zhu, Sijie Yan   +5 more
semanticscholar   +2 more sources

Effects of undeformed chip thickness on grinding temperature and burn-out in high-efficiency deep grinding of Inconel718 superalloys

, 2017
Chenwei Dai, W. Ding, Jiu-hua Xu, Xipeng Xu, Dengkui Fu   +4 more
semanticscholar   +1 more source