Results 121 to 130 of about 2,745 (141)
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Semiconductor Science and Technology, 2020
Abstract In order to achieve the ductile mode cutting of silicon and avoid the generation of subsurface crack damage, the undeformed chip thickness in the diamond cutting process must be controlled below the critical value. Therefore, the critical undeformed chip thickness (CUCT) for the ductile mode cutting of silicon is studied in ...
Longxu Yao +3 more
openaire +1 more source
Abstract In order to achieve the ductile mode cutting of silicon and avoid the generation of subsurface crack damage, the undeformed chip thickness in the diamond cutting process must be controlled below the critical value. Therefore, the critical undeformed chip thickness (CUCT) for the ductile mode cutting of silicon is studied in ...
Longxu Yao +3 more
openaire +1 more source
Precision Engineering, 2016
Abstract In the last decades, micromachining has gained increased relevance as an alternative method to produce miniaturized parts for a wide range of products. Nevertheless, micromachining differs considerably from conventional machining in many aspects.
Marcelo A. Câmara +4 more
openaire +1 more source
Abstract In the last decades, micromachining has gained increased relevance as an alternative method to produce miniaturized parts for a wide range of products. Nevertheless, micromachining differs considerably from conventional machining in many aspects.
Marcelo A. Câmara +4 more
openaire +1 more source
Key Engineering Materials, 2010
Microgroove processes are carried out on Potassium Dihydrogen Phosphate (KDP) crystals of different crystalline orientation using diamond tool, the speed of groove is very low in order to avoid the influence of temperature. The main process characteristics are examined including the groove geometry, cutting forces and critical underformed chip ...
Hao Feng Chen +4 more
openaire +1 more source
Microgroove processes are carried out on Potassium Dihydrogen Phosphate (KDP) crystals of different crystalline orientation using diamond tool, the speed of groove is very low in order to avoid the influence of temperature. The main process characteristics are examined including the groove geometry, cutting forces and critical underformed chip ...
Hao Feng Chen +4 more
openaire +1 more source
International Journal of Machine Tools and Manufacture, 2013
Abstract There is a distinct transition in the mode of material removal in machining of brittle materials if the undeformed chip thickness is below a critical threshold of submicron scale. It is believed that at such small scale of material removal, the energy required to extend pre-existing flaws in the microstructure of brittle material exceeds the
Arif, M. +3 more
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Abstract There is a distinct transition in the mode of material removal in machining of brittle materials if the undeformed chip thickness is below a critical threshold of submicron scale. It is believed that at such small scale of material removal, the energy required to extend pre-existing flaws in the microstructure of brittle material exceeds the
Arif, M. +3 more
openaire +1 more source
Predictive modeling of undeformed chip thickness in ceramic grinding
International Journal of Machine Tools and Manufacture, 2012P Venkateswara Rao
exaly
International Journal of Machine Tools and Manufacture, 2017
Wen-Feng Ding, Tianyu Yu, Yucan Fu
exaly
Wen-Feng Ding, Tianyu Yu, Yucan Fu
exaly
Model of the instantaneous undeformed chip thickness in micro-milling based on tooth trajectory
Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 2018Xiaohong Lu
exaly