Results 101 to 110 of about 3,212,901 (332)

Intrinsically Radioactive [64Cu]CuInS/ZnS Quantum Dots for PET and Optical Imaging: Improved Radiochemical Stability and Controllable Cerenkov Luminescence [PDF]

open access: bronze, 2014
Weisheng Guo   +9 more
openalex   +1 more source

Enhanced Oxidation and Thermal Shock Resistance of N‐type Mg2Si0.89(Sn0.1,Sb0.01) Thermoelectric Material via Cr0.9Si0.1 Coating

open access: yesAdvanced Engineering Materials, EarlyView.
Cr0.9Si0.1 protective coatings are developed to enhance the thermal‐shock and oxidation resistance of Mg2Si0.89(Sn0.1,Sb0.01) thermoelectric (TE) materials. The coating forms a dense and adherent barrier that suppresses oxygen diffusion and mitigates mechanical degradation during cyclic oxidation, demonstrating its potential to improve the long‐term ...
Mikdat Gurtaran   +3 more
wiley   +1 more source

Microstructural Evolution and Mechanical Performance of Plasma‐Assisted Hybrid Friction Stir Welded Dissimilar Aluminum–Copper Joints

open access: yesAdvanced Engineering Materials, EarlyView.
Plasma‐assisted hybrid friction stir welding of dissimilar AlCu joints employs localized plasma preheating to balance heat input and enhance plastic flow. The optimized process reduces axial force by up to 35%, refines the microstructure, and achieves ≈96% joint efficiency.
Deepak Kumar Yaduwanshi   +3 more
wiley   +1 more source

UTILISING Zn AND Cu PRODU T IN THE CORN MEAL SUBSTRATE AT Saccharomyces cerev s ae BIOPRO ESS AND ITS IMPLEMENTATION ON INTERNAL QUALITY OF BROILER [PDF]

open access: yes, 2009
This research was conducte to find out the effect and optimal percentage of adding Zn and Cu proteinat supplement product of fermentation by Saccharomyces cerev s ae in the ration on internal quality of the broiler.The experiment use 125 broiler day ol
Abun, Abun   +3 more
core  

Investigation on diffusion soldering in Cu/In/Cu and Cu/In-48Sn/Cu systems

open access: yes, 2002
Das Diffusionslöten ist ein bleifreies Verbindungsverfahren, das ein großes Potential zur Lösung vieler moderner Verbindungsprobleme bietet. Sie bestehen darin, dass die Verbindungsstellen in der Mikroelektronik immer kleiner werden, zu immer höheren Temperaturen ausgesetzt werden, bei tieferen Temperaturen herstellbar und bleifrei sein sollen.
openaire   +3 more sources

Rheocasting versus Die Casting: An Insight into the Low‐Cycle Fatigue Behavior of AlSi7Mg0.6

open access: yesAdvanced Engineering Materials, EarlyView.
The study compares rheocast lightweight components with high‐pressure die cast materials regarding microstructure and fatigue behavior. Rheocast process offers higher efficiency due to lower casting temperatures. Despite some microstructural differences, both processes show similar strengths (yield strength 125 MPa, tensile strength 240 MPa).
Julia Richter   +4 more
wiley   +1 more source

Surfactant induced smooth and symmetric interfaces in Cu/Co multilayers

open access: yes, 2011
In this work we studied Ag surfactant induced growth of Cu/Co multilayers. The Cu/Co multilayers were deposited using Ag surfactant by ion beam sputtering technique.
A Wildes   +11 more
core   +1 more source

Can Ti‐Based MXenes Serve as Solid Lubricants for Brake Applications? A Tribological Study

open access: yesAdvanced Engineering Materials, EarlyView.
This study explores the first implementation of Ti‐based MXenes materials in brake pad friction composite material. The resulting composite material exhibits a 48% reduction in the wear rate; alongside significant improvements are observed for thermal and mechanical properties.
Eslam Mahmoud   +7 more
wiley   +1 more source

Adsorption of Cu(II) from Aqueous Solution on Fly Ash Based Linde F (K) Zeolite [PDF]

open access: yesIranian Journal of Chemistry & Chemical Engineering, 2014
The work focuses on the removing of Cu(II) from aqueous solution by Linde F(K) zeolite. The zeolite is synthesized from fly ash by hydrothermal process. The adsorption experiments discuss several factors including the optimal solution pH, zeolite dosage,
Chen Chen   +3 more
doaj  

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