Results 81 to 90 of about 1,116,119 (297)

Characterization of Aluminized Layers on Inconel‐738 Alloy: Microstructure, Modeling of Aluminizing Kinetics, and Thermal Behavior

open access: yesAdvanced Engineering Materials, EarlyView.
This study explored how effective nickel aluminide coatings are obtained in providing oxidation resistance applied to the Inconel 738 alloy, modeling with diffusion models. In the present study, kinetics and thermal behavior of the Inconel 738 alloy were studied by the low‐temperature thermoreactive aluminizing process, which was carried out at 625°C ...
Gozde Celebi Efe   +4 more
wiley   +1 more source

Oxidation kinetics of a Ni-Cu based cermet at high temperature [PDF]

open access: yes, 2013
The oxidation kinetics of a cermet composed of Ni–Cu alloy and nickel ferrite was studied by thermogravimetry at 960 °C under oxygen in the range 0.5–77 kPa. After an initial mass increase up to 15 g/m2 due to oxidation of surface metallic particles, the
Palau, Patrice   +14 more
core   +1 more source

Thermomechanical Fatigue and Creep–Fatigue Interaction of Inconel 718 Additively Manufactured by Laser Beam Powder Bed Fusion

open access: yesAdvanced Engineering Materials, EarlyView.
Thermomechanical fatigue tests of laser beam powder bed fusion (PBF‐LB) Inconel 718 show that the additively manufactured material reaches almost the lifetimes of conventionally‐rolled material under no‐dwell conditions. Introducing dwell times at the maximum temperature markedly reduces the lifetimes due to pronounced grain boundary sliding associated
Stefan Guth   +6 more
wiley   +1 more source

Serum Levels of Zinc, Copper, Selenium and Glutathione Peroxidase in Different Groups of Colorectal Cancer Patients

open access: yesCaspian Journal of Internal Medicine, 2020
Background: Colorectal cancer (CRC) is considered the fourth type of cancer that causes death in the world. Changes in levels of Zinc (Zn), Copper (Cu), and Selenium (Se) as well as low glutathione peroxidase (GPx) activity can lead to CRC and this study
Ghassan Sulaiman   +2 more
doaj  

Evaluación de cobre y cinc en suero sanguíneo de pacientes diabéticos con y sin pie diabético

open access: yesQhaliKay, 2019
Los micronutrientes, cobre (Cu) y cinc (Zn) cumplen funciones indispensables para el desarrollo y crecimiento celular. Por tal razón, este trabajo presenta la evaluación de los niveles séricos de Cu y Zn de pacientes diabéticos con y sin pie diabético ...
Blanca Irene Semprun de Villasmil   +5 more
doaj   +1 more source

Field Report from Collaborative Research Center 1625: Heterogeneous Research Data Management Using Ontology Representations

open access: yesAdvanced Engineering Materials, EarlyView.
A unified research data management framework for heterogeneous materials data is presented. The system integrates multimodal datasets using ontologies and knowledge graphs, enabling interoperability and FAIR (findable, accessible, interoperable, reusable) data principles. By linking data across scales and workflows, it supports reproducible, Artifitial
Doaa Mohamed   +6 more
wiley   +1 more source

Adsorção de Cu(II), Cd(II) e Pb(II) em soluções individuais, binárias e ternárias pela quitosana modificada com epicloridrina/trifosfato [PDF]

open access: yes, 2012
Tese (doutorado) - Universidade Federal de Santa Catarina, Centro de Ciências Físicas e Matemáticas, Programa de Pós-Graduação em Química, Florianópolis, 2011O objetivo deste trabalho foi tornar a quitosana insolúvel em meio ácido utilizando os agentes ...
Laus, Rogério
core  

High-Definition Rib (HDR) Body Contouring Surgery: UUAIST and RIBOSS

open access: yesPlastic and Reconstructive Surgery, Global Open, 2023
Mauricio Perez   +2 more
doaj   +1 more source

Effect of Se-metal pair combinations (Cd, Zn, Cu, Pb) on photosynthetic pigmentsproduction and Metal accumulation in Sinapis alba L. seedlings

open access: yesPlant, Soil and Environment, 2006
The priority of this study was to investigate how selenium influences toxicity of Cd, Zn, Cu and Pb when the metals appear in the hydroponic solution in pairs. As a model subject mustard seedlings (Sinapis alba L.) were used.
A. Fargašová   +2 more
doaj   +1 more source

Development of Cu CMP process for Cu-to-Cu wafer stacking

open access: yesJournal of the Microelectronics and Packaging Society, 2013
웨이퍼 적층 기술은 반도체 전·후 공정을 이용한 효과적인 방법으로 향후 3D 적층 시스템의 주도적인 발전방향이라고 할 수 있다. 웨이퍼 레벨 3D 적층 시스템을 제조하기 위해서는 TSV (Through Si Via), 웨이퍼 본딩, 그리고웨이퍼 thinning의 단위공정 개발 및 웨이퍼 warpage,열적 기계적 신뢰성, 전력전달, 등 시스템적인 요소에 대한 연구개발이 동시에 진행되어야 한다. 본 연구에서는 웨이퍼 본딩에 가장 중요한 역할을 하는 Cu CMP (chemical mechanicalpolishing) 공정에 대한 특성 분석을 진행하였다.
Inhyeop Song   +3 more
openaire   +2 more sources

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