Results 71 to 80 of about 1,113,963 (297)
Background. Complex Au-Cu-U mineralization is found in the metamorphic rocks of central Vietnam in the zones of their contact with Triassic granite intrusions.
Minh Phuong Do +4 more
doaj +1 more source
Wettability of molten Sn-Bi-Cu solder on Cu substrate
The wetting behavior of a new Sn-Bi-Cu Pb-firee solder on Cu substrate was investigated by sessile drop method under an Ar-H(2) flow in the temperature range from 493 K to 623 K.
Zhao, Hongxin +8 more
core +1 more source
Powder metal processing provides scalable advantages in nanoporous (np) metal development. Mechanical alloying is used to produce unique precursors for hybrid nanopore formation by oxide reduction and dealloying. As demonstrated in np Ag, this approach improves process efficiency while promoting smaller ligaments and larger pores, both of which are ...
Mark A. Atwater, Oliver A. Fowler
wiley +1 more source
Oxidation kinetics of a Ni-Cu based cermet at high temperature [PDF]
The oxidation kinetics of a cermet composed of Ni–Cu alloy and nickel ferrite was studied by thermogravimetry at 960 °C under oxygen in the range 0.5–77 kPa. After an initial mass increase up to 15 g/m2 due to oxidation of surface metallic particles, the
Palau, Patrice +14 more
core +1 more source
The corrosion performance of AlSi7Mg and AlSi10Mg alloys produced through selective laser melting (SLM) was examined under compressive stress in a chloride environment. Electrochemical analyses, including open‐circuit potential (OCP), potentiodynamic polarization (CPP), and electrochemical impedance spectroscopy (EIS), were complemented by scanning ...
Femi John Akinfolarin +2 more
wiley +1 more source
This study explored how effective nickel aluminide coatings are obtained in providing oxidation resistance applied to the Inconel 738 alloy, modeling with diffusion models. In the present study, kinetics and thermal behavior of the Inconel 738 alloy were studied by the low‐temperature thermoreactive aluminizing process, which was carried out at 625°C ...
Gozde Celebi Efe +4 more
wiley +1 more source
Background: Colorectal cancer (CRC) is considered the fourth type of cancer that causes death in the world. Changes in levels of Zinc (Zn), Copper (Cu), and Selenium (Se) as well as low glutathione peroxidase (GPx) activity can lead to CRC and this study
Ghassan Sulaiman +2 more
doaj
Development of Cu CMP process for Cu-to-Cu wafer stacking
웨이퍼 적층 기술은 반도체 전·후 공정을 이용한 효과적인 방법으로 향후 3D 적층 시스템의 주도적인 발전방향이라고 할 수 있다. 웨이퍼 레벨 3D 적층 시스템을 제조하기 위해서는 TSV (Through Si Via), 웨이퍼 본딩, 그리고웨이퍼 thinning의 단위공정 개발 및 웨이퍼 warpage,열적 기계적 신뢰성, 전력전달, 등 시스템적인 요소에 대한 연구개발이 동시에 진행되어야 한다. 본 연구에서는 웨이퍼 본딩에 가장 중요한 역할을 하는 Cu CMP (chemical mechanicalpolishing) 공정에 대한 특성 분석을 진행하였다.
Inhyeop Song +3 more
openaire +2 more sources
Adsorção de Cu(II), Cd(II) e Pb(II) em soluções individuais, binárias e ternárias pela quitosana modificada com epicloridrina/trifosfato [PDF]
Tese (doutorado) - Universidade Federal de Santa Catarina, Centro de Ciências Físicas e Matemáticas, Programa de Pós-Graduação em Química, Florianópolis, 2011O objetivo deste trabalho foi tornar a quitosana insolúvel em meio ácido utilizando os agentes ...
Laus, Rogério
core
This study demonstrates an efficient recycling route for out‐of‐spec AlSi10Mg atomized powders through compaction and arc remelting followed by suction casting. By correlating compaction load, cooling rate, and resulting microstructure, we show that intermediate pressures (50–80 kN) and rapid cooling refine dendrites, reduce porosity, and enhance ...
Mila Christy de Oliveira +4 more
wiley +1 more source

