Results 291 to 300 of about 366,258 (347)
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Application of multi-fidelity simulation modelling to integrated circuit packaging
International Journal of Simulation and Process Modelling, 2016Liam Y. Hsieh +4 more
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Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated Circuit Design Space
IEEE Computer Society Annual Symposium on VLSI, 2016Dylan C. Stow +4 more
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IEEE Transactions on Circuits and Systems Part 1: Regular Papers, 2017
Liao Wu +3 more
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Liao Wu +3 more
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4598308 Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
Microelectronics Reliability, 1987ChristopherD James, Norman McNeal
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Architecting 3-D integrated circuit fabric with intrinsic thermal management features
IEEE/ACM International Symposium on Nanoscale Architectures, 2015Mostafizur Rahman +4 more
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Breaking Integrated Circuit Device Security through Test Mode Silicon Reverse Engineering
Conference on Computer and Communications Security, 2014Markus Kammerstetter +4 more
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Innovative Scaling Method to Minimize Cost of Integrated Circuit Packages and Devices
IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2014B. Bhattacharyya +3 more
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