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Diffusion bonding of Ti and Zr at ultra-low temperature via surface nano-crystallization treatment
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 2020The diffusion bonding of Ti and Zr has been realised at an ultra-low temperature of 650 °C by nanocrystallising the substrate surfaces. The bonding temperature is about 100 °C lower than the standard diffusion bonding approach. The achieved joint shows a
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The diffusion behavior of the elements in the diffusion bonding based on nanostructured surface layer was studied, using the copper diffusion bonding as an example.
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