Results 231 to 240 of about 1,558,331 (296)

Atmospheric Water Harvesting Through Polymer Hydrogel Sorbents: Materials Chemistry, Design Strategies, and Applications. [PDF]

Adv Sci (Weinh)
Datta S, Sen S, Dey N, Chatterjee A, Sadhu A, Sarkar S, Maji PK.   +6 more
europepmc   +1 more source

The Role of Surface Chemistry and pH Shifts in the Sorption of Common NSAIDs on Coconut and Orange Waste-Derived Carbon Materials. [PDF]

Molecules
Olivarez JA, Hernández V, Mandujano-Zúñiga HP, Sánchez RA, Godínez LA, García-Espinoza JD, Vela-Carrillo AZ, Rodríguez-Valadez FJ, Santos-Blanco M, Ortega-Borges R, Robles I.   +10 more
europepmc   +1 more source

Retention of noble gases in the deep Earth: Kinetic trapping or stable bonding? [PDF]

Sci Adv
Figowy S, Caracas R, Avice G.
europepmc   +1 more source

Effect of Initial Rolling Temperature on Interfacial Reaction-Diffusion, Cladding Stability, and Tensile Failure of Industrially Hot-Rolled 316L/SWRH82B Clad Wire Rods. [PDF]

Materials (Basel)
Zeng L, Lu W, Gou Z, Zhou G, Zhuang Z, Qian X, Li Z, Tan J.   +7 more
europepmc   +1 more source

Molecular dynamics modeling of diffusion bonding

Scripta Materialia, 2005
Molecular dynamics simulations on diffusion bonding of Cu-Ag showed that the thickness of the interfacial region depended on the stress. The interfacial region became amorphous during diffusion bonding, and it would normally transform from amorphous into
A K Soh
exaly   +2 more sources

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Theoretical model for diffusion bonding

Metal Science, 1982
AbstractDespite successful applications of diffusion bonding, there is uncertainty as to the dominant mechanisms which operate when the two surfaces to be joined are brought together under an applied pressure at an elevated temperature. This paper describes a theoretical model for solid-state diffusion bonding, the aim of which is to understand how the
Derby, B.; id_orcid 0000-0001-5753-0166, Wallach, E. R.   +1 more
openaire   +1 more source

Diffusion bonds in copper

Journal of Materials Science, 1984
The diffusion bonding of copper is studied experimentally and the results are compared with the predictions of a model of the bonding process. The dominant bonding mechanism is shown to be the power-law creep deformation of contacting surface asperities at high surface roughnesses.
Derby, B.; id_orcid 0000-0001-5753-0166, Wallach, E. R.   +1 more
openaire   +1 more source

Fundamentals of Diffusion Bonding

1993
Abstract Diffusion bonding is only one of many solid-state joining processes wherein joining is accomplished without the need for a liquid interface (brazing) or the creation of a cast product via melting and resolidification. This article offers a qualitative summary of the theory of diffusion bonding.
Murray W. Mahoney, Cliff C. Bampton
openaire   +1 more source