Results 241 to 250 of about 2,937,719 (310)
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Vacuum, 2019
A serious of diffusion bonding (DB) tests between high Nb containing TiAl alloy and Ti2AlNb alloy were conducted and the bonded joints were post-bonded heat treated (PBHT) at 1000 °C for 10h.
Lei Zhu +6 more
semanticscholar +1 more source
A serious of diffusion bonding (DB) tests between high Nb containing TiAl alloy and Ti2AlNb alloy were conducted and the bonded joints were post-bonded heat treated (PBHT) at 1000 °C for 10h.
Lei Zhu +6 more
semanticscholar +1 more source
Vacuum, 2019
The joining of 4J29 kovar alloy and 316L stainless steel with a Co interlayer was successfully accomplished by vacuum diffusion bonding in a temperature range of 855–945 °C, and an axial load of 10 MPa was employed to acquire diffusion-bonded joints ...
Y. J. Fang +4 more
semanticscholar +1 more source
The joining of 4J29 kovar alloy and 316L stainless steel with a Co interlayer was successfully accomplished by vacuum diffusion bonding in a temperature range of 855–945 °C, and an axial load of 10 MPa was employed to acquire diffusion-bonded joints ...
Y. J. Fang +4 more
semanticscholar +1 more source
Vacuum diffusion bonding W to W-Cu composite: Interfacial microstructure and mechanical properties
Vacuum, 2019W and W-10 wt% Cu (W-10Cu) were joined by diffusion bonding with an Fe-Ni-Cu interlayer in a vacuum of 10−3 Pa. The effects of the bonding temperature (950 °C, 1000 °C, 1050 °C, 1100 °C, 1150 °C and 1200 °C) on the microstructure and corresponding ...
Haixian Yan +6 more
semanticscholar +1 more source
Journal of Materials Processing Technology, 2019
Titanium alloy components are subjected to challenging conditions in high performance applications, consisting of complex loads and thermal gradients. To improve the performance and efficiency of such components, it is desirable to introduce different ...
Jacob J. Pope +3 more
semanticscholar +1 more source
Titanium alloy components are subjected to challenging conditions in high performance applications, consisting of complex loads and thermal gradients. To improve the performance and efficiency of such components, it is desirable to introduce different ...
Jacob J. Pope +3 more
semanticscholar +1 more source
Materialwissenschaft und Werkstofftechnik, 2014
Worldwide there is a trend to use diffusion bonding for more and more applications, for example for optical components, micro devices and heat transfer elements. Despite that the market for diffusion bonded product is still small today, more than 30 companies offer diffusion bonding systems worldwide.
S. Jahn, S. Sändig, S. Dahms, F. Gemse
openaire +1 more source
Worldwide there is a trend to use diffusion bonding for more and more applications, for example for optical components, micro devices and heat transfer elements. Despite that the market for diffusion bonded product is still small today, more than 30 companies offer diffusion bonding systems worldwide.
S. Jahn, S. Sändig, S. Dahms, F. Gemse
openaire +1 more source
Diffusion bonding of hydrogenated TC4 alloy and GH3128 superalloy using composite interlayers
, 2019The Nb and Nb/Ni interlayers were designed for the diffusion bonding of the hydrogenated TC4 alloy and GH3128 superalloy joint. Typical microstructure of the TC4-0.3 H/Nb(Ni/Nb)/GH3128 joints were investigated.
L. X. Zhang +4 more
semanticscholar +1 more source
Nano-diffusion bonding of Ti2AlNb to Ni-based superalloy
Materials Characterization, 2019Ti2AlNb alloys are one of the most promising structural materials with potential applications in aero-engines. Dissimilar joining of Ti2AlNb alloy to Ni-based superalloy was carried out with diffusion bonding method using Cu + Ti composite foil and Cu/Ti
H. Ren +5 more
semanticscholar +1 more source
Effect of hydrogen addition on diffusion bonding behavior of Ti-55 alloy
Materials Science & Engineering: A, 2019The mechanism of hydrogen-induced void closure during diffusion bonding (DB) process of hydrogenated Ti-55 alloy with different hydrogen contents at different temperatures has been investigated.
Huiping Wu +3 more
semanticscholar +1 more source
Journal of Materials Science, 1984
The diffusion bonding of copper is studied experimentally and the results are compared with the predictions of a model of the bonding process. The dominant bonding mechanism is shown to be the power-law creep deformation of contacting surface asperities at high surface roughnesses.
Derby, B.; id_orcid 0000-0001-5753-0166 +1 more
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The diffusion bonding of copper is studied experimentally and the results are compared with the predictions of a model of the bonding process. The dominant bonding mechanism is shown to be the power-law creep deformation of contacting surface asperities at high surface roughnesses.
Derby, B.; id_orcid 0000-0001-5753-0166 +1 more
openaire +1 more source
Intermetallics, 1993
Abstract Diffusion-bonding of TiAl (48 at.% Al) using both solid-state and transient-liquid-phase (TLP) processes was studied. In solid-state diffusion-bonding, dynamic recrystallization which occurs at the bond-line during bonding is found to have a significant effect on improving bond strength.
P. Yan, E.R. Wallach
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Abstract Diffusion-bonding of TiAl (48 at.% Al) using both solid-state and transient-liquid-phase (TLP) processes was studied. In solid-state diffusion-bonding, dynamic recrystallization which occurs at the bond-line during bonding is found to have a significant effect on improving bond strength.
P. Yan, E.R. Wallach
openaire +1 more source