Results 241 to 250 of about 1,558,331 (296)
Some of the next articles are maybe not open access.

Diffusion-bonding of TiAl

Intermetallics, 1993
Abstract Diffusion-bonding of TiAl (48 at.% Al) using both solid-state and transient-liquid-phase (TLP) processes was studied. In solid-state diffusion-bonding, dynamic recrystallization which occurs at the bond-line during bonding is found to have a significant effect on improving bond strength.
P. Yan, E.R. Wallach
openaire   +1 more source

Modeling of Diffusion Bonding

2010
Abstract The goals of modeling diffusion bonding can be regarded as twofold: to optimize the selection of the process variables for a given material and to provide an understanding of the mechanisms by which bonding is achieved. This article describes the existing models of diffusion bonding with an assumption that the surfaces to be ...
openaire   +1 more source

Diffusion bonding systems

Materialwissenschaft und Werkstofftechnik, 2014
Worldwide there is a trend to use diffusion bonding for more and more applications, for example for optical components, micro devices and heat transfer elements. Despite that the market for diffusion bonded product is still small today, more than 30 companies offer diffusion bonding systems worldwide.
S. Jahn, S. Sändig, S. Dahms, F. Gemse
openaire   +1 more source

Diffusion Bonding 2

1991
There is currently great interest in the process of diffusion bonding. The main thrust has been in the joining of advanced materials such as superplastic alloys, metal matrix composites and ceramics and, most importantly, to introduce the process into mass-production operations.
openaire   +1 more source

Diffusion doping in quantum dots: bond strength and diffusivity

Nanoscale, 2017
Semiconducting materials uniformly doped with optical or magnetic impurities have been useful in a number of potential applications. However, clustering or phase separation during synthesis has made this job challenging. Recently the "inside out" diffusion doping was proposed to be successful in obtaining large sized quantum dots (QDs) uniformly doped ...
Avijit, Saha   +5 more
openaire   +2 more sources

SITE- AND BOND-DIFFUSION ON REGULAR LATTICES

International Journal of Modern Physics B, 2009
We consider two types of motion, one with particle occupying only the sites on a given regular lattice and another when the bonds between neighboring lattice sites are displaced to the positions of the neighboring bonds. We refer to these models as site- and bond-diffusion.
Basnarkov, Lasko, Urumov, Viktor
openaire   +2 more sources

Diffusion bonding: development of theoretical model

Metal Science, 1984
In previous work, a theoretical model for solid state diffusion bonding was described. The vapor phase mass transport rate equations are now derived. In addition, a revised model is presented for the power law creep mechanism based on considerations of the elastic and plastic deformation of a long triangular ridge.
Derby, B.; id_orcid 0000-0001-5753-0166   +1 more
openaire   +2 more sources

Diffusion Bonding — An Overview

1991
Diffusion bonding is a microdeformation solid phase process finding application in niche areas. The mechanisms of bonding are generally understood, and data on modelling is available although limited to simple metal systems.
openaire   +1 more source

Low-Pressure Diffusion Bonding of Titanium

Journal of Spacecraft and Rockets, 1978
This paper describes a new manufacturing process for diffusion bonding of titanium alloys. The technique requires the use of high-vacuum furnaces, but allows bonding to be carried out at very low contact pressures. This is possible because the parts are kept separate during outgassing through the innovative use of glass tooling.
J. KENNEY, C. DEMINET
openaire   +1 more source

Diffusion bonding of mismatch dental alloys

Journal of Biomedical Materials Research Part B: Applied Biomaterials, 2009
AbstractThe diffusion bonding of Ti‐6Al‐4V and Co‐Cr‐Mo dental alloys has been investigated in terms of the atoms diffusion, the microstructure evolution, and the bonding strength. The bonding performance reveals asymmetry diffusion profiles for both the Co and Cr in Ti‐6Al‐4V and the Ti in Co‐Cr‐Mo alloy.
Honghua, Liu   +3 more
openaire   +2 more sources

Home - About - Disclaimer - Privacy