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Diffusion bonding of mismatch dental alloys

Journal of Biomedical Materials Research Part B: Applied Biomaterials, 2009
AbstractThe diffusion bonding of Ti‐6Al‐4V and Co‐Cr‐Mo dental alloys has been investigated in terms of the atoms diffusion, the microstructure evolution, and the bonding strength. The bonding performance reveals asymmetry diffusion profiles for both the Co and Cr in Ti‐6Al‐4V and the Ti in Co‐Cr‐Mo alloy.
Honghua, Liu   +3 more
openaire   +2 more sources

Hydrogen bonding and diffusion in crystalline silicon

Physical Review B, 1989
The nature of hydrogen bonding and diffusion in crystalline Si was investigated using an ab initio self-consistent pseudopotential method. The relative energies of interstitial atomic hydrogen, diatomic hydrogen complexes, and shallow dopant-hydrogen complexes were examined.
CHANG, KJ Chang, Kee-Joo, CHADI, DJ
openaire   +2 more sources

Acoustic harmonic generation at diffusion bonds

Journal of Nondestructive Evaluation, 1997
The distortion of a sinusoidal acoustic wave at unbonded interfaces has been determined in terms of the first and second harmonic amplitudes. The results demonstrate for the first time that the second harmonic can reach the theoretically predicted maximum value.
D. J. Barnard   +3 more
openaire   +1 more source

Diffusion bonding of A2017 aluminium alloy

Welding International, 1990
Diffusion bonding is a solid phase welding process in which bonding occurs through coalescence of the surfaces in contact. The principal operating parameters of diffusion bonding are the temperature, pressure and the bonding time. In addition to diffusion, other mechanisms such as microscopic creep or recrystallization also contribute to the formation ...
T. Latouche   +3 more
openaire   +1 more source

Study on microstructure and impact toughness of TC4 titanium alloy diffusion bonding joint

Vacuum, 2018
TC4 titanium alloy was diffusion bonded under small axial pressure of 0.5 MPa to restrain the deformation. The sample surfaces, prior to bonding, were finely polished to Ra 0.3 μm.
Hao Zhang   +4 more
semanticscholar   +1 more source

Diffusion Bonding

2018
Rui Pan, Dusan P. Sekulic
openaire   +1 more source

GAS QUENCH FOR DIFFUSION BONDING

2022
BEHNKE JOSEPH F   +2 more
openaire   +2 more sources

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