Results 261 to 270 of about 105,698 (309)

Diffusion bonds in copper

Journal of Materials Science, 1984
The diffusion bonding of copper is studied experimentally and the results are compared with the predictions of a model of the bonding process. The dominant bonding mechanism is shown to be the power-law creep deformation of contacting surface asperities at high surface roughnesses.
Derby, B.; id_orcid 0000-0001-5753-0166, Wallach, E. R.   +1 more
openaire   +1 more source

Fundamentals of Diffusion Bonding

1993
Abstract Diffusion bonding is only one of many solid-state joining processes wherein joining is accomplished without the need for a liquid interface (brazing) or the creation of a cast product via melting and resolidification. This article offers a qualitative summary of the theory of diffusion bonding.
Murray W. Mahoney, Cliff C. Bampton
openaire   +1 more source

Diffusion-bonding of TiAl

Intermetallics, 1993
Abstract Diffusion-bonding of TiAl (48 at.% Al) using both solid-state and transient-liquid-phase (TLP) processes was studied. In solid-state diffusion-bonding, dynamic recrystallization which occurs at the bond-line during bonding is found to have a significant effect on improving bond strength.
P. Yan, E.R. Wallach
openaire   +1 more source

Diffusion doping in quantum dots: bond strength and diffusivity

Nanoscale, 2017
Semiconducting materials uniformly doped with optical or magnetic impurities have been useful in a number of potential applications. However, clustering or phase separation during synthesis has made this job challenging. Recently the "inside out" diffusion doping was proposed to be successful in obtaining large sized quantum dots (QDs) uniformly doped ...
Avijit, Saha, Mahima, Makkar, Amitha, Shetty, Kushagra, Gahlot, Pavan, A R, Ranjani, Viswanatha   +5 more
openaire   +2 more sources

SITE- AND BOND-DIFFUSION ON REGULAR LATTICES

International Journal of Modern Physics B, 2009
We consider two types of motion, one with particle occupying only the sites on a given regular lattice and another when the bonds between neighboring lattice sites are displaced to the positions of the neighboring bonds. We refer to these models as site- and bond-diffusion.
Basnarkov, Lasko, Urumov, Viktor
openaire   +2 more sources

Diffusion bonding: development of theoretical model

Metal Science, 1984
In previous work, a theoretical model for solid state diffusion bonding was described. The vapor phase mass transport rate equations are now derived. In addition, a revised model is presented for the power law creep mechanism based on considerations of the elastic and plastic deformation of a long triangular ridge.
Derby, B.; id_orcid 0000-0001-5753-0166, Wallach, E. R.   +1 more
openaire   +2 more sources

Diffusion bonding of mismatch dental alloys

Journal of Biomedical Materials Research Part B: Applied Biomaterials, 2009
AbstractThe diffusion bonding of Ti‐6Al‐4V and Co‐Cr‐Mo dental alloys has been investigated in terms of the atoms diffusion, the microstructure evolution, and the bonding strength. The bonding performance reveals asymmetry diffusion profiles for both the Co and Cr in Ti‐6Al‐4V and the Ti in Co‐Cr‐Mo alloy.
Honghua, Liu, Jiahua, Ni, Luhai, Wu, Guo, He   +3 more
openaire   +2 more sources

Hydrogen bonding and diffusion in crystalline silicon

Physical Review B, 1989
The nature of hydrogen bonding and diffusion in crystalline Si was investigated using an ab initio self-consistent pseudopotential method. The relative energies of interstitial atomic hydrogen, diatomic hydrogen complexes, and shallow dopant-hydrogen complexes were examined.
CHANG, KJ Chang, Kee-Joo, CHADI, DJ
openaire   +2 more sources

Low-Pressure Diffusion Bonding of Titanium

Journal of Spacecraft and Rockets, 1978
This paper describes a new manufacturing process for diffusion bonding of titanium alloys. The technique requires the use of high-vacuum furnaces, but allows bonding to be carried out at very low contact pressures. This is possible because the parts are kept separate during outgassing through the innovative use of glass tooling.
J. KENNEY, C. DEMINET
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Acoustic harmonic generation at diffusion bonds

Journal of Nondestructive Evaluation, 1997
The distortion of a sinusoidal acoustic wave at unbonded interfaces has been determined in terms of the first and second harmonic amplitudes. The results demonstrate for the first time that the second harmonic can reach the theoretically predicted maximum value.
D. J. Barnard, G. E. Dace, D. K. Rehbein, O. Buck   +3 more
openaire   +1 more source