Results 131 to 140 of about 112,493 (258)
A model of dislocations at the interface of the bonded wafers
, 2000 Wafer bonding is regardless of lattice mismatch in the integration of dissimilar semiconductor materials. This technology differs from the heteroepitaxy mainly in the mechanism of generating dislocations at the interface.
Wei HZ +6 more
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A Novel Approach to Estimate the Transition Temperature via Dynamic Nanoindentation
Advanced Engineering Materials, EarlyView.A new dynamic nanoindentation‐based method was developed that uses the stiffness ratio as an indicator of the elastic–plastic deformation contributions at different temperatures. The approach successfully identified transition temperatures in ferritic steel and distinguished them from continuously ductile austenitic steel.
Stefan Zeiler +4 more
wiley +1 more source
Advanced Engineering Materials, EarlyView.This perspective reframes additive manufacturing for electrical machines as a qualification‐limited materials and architecture design problem. It links process–structure–property–performance relationships to magnetic, conducting, dielectric, and thermal property windows, highlighting where AM can enable segmented magnetic circuits, permanent magnet ...
Dénes Fodor, Loránd Szabó
wiley +1 more source
Advanced Engineering Materials, EarlyView.Near‐surface deuterium enrichment profiles for different microstructural types of TiAl after exposure at 700 °C in a heavy water‐containing environment. The deuterium levels are significantly higher than expected from natural occurrence, indicating that the heavy water dissociated during the exposure treatment and entered the specimens.
Jonathan D. H. Paul +5 more
wiley +1 more source
Advanced Engineering Materials, EarlyView.A high interstital austenitic steel is additively manufactured and postdensified by HIP to eliminate gas porosity. Thereby, the loss of N and Mn in Ar HIP atmosphere is investigated. Further, HIP using N2 atmosphere is investigated which led to excessive nitride formation.
F. Großwendt +4 more
wiley +1 more source
Photoluminescent method for studying the plastic deformation at the boudary of «SiO2–Si»
Технологія та конструювання в електронній апаратурі, 2012 The possibility of using the photoluminescence method for studying the mechanisms of plastic deformation at the boundary of "SiO2 — Si" in the process of obtaining nanostructured silicon layers by deformation.
О. А. Kulinich +4 more
doaj
Modeling Dislocations at Different Scales
, 2006 In this article, we give an introduction to the basic theory of dislocations and some dislocation models at different length scales. Dislocations are line defects in crystals. The continuum theory of dislocations works well at the length scale of several
Xiang, Yang
core
Advanced Engineering Materials, EarlyView.Additive manufacturing introduces pronounced microstructural and crystallographic anisotropy in Ni‐based superalloys, resulting in orientation‐dependent creep deformation and damage. This review identifies the key microstructural origins of creep anisotropy, examines their influence on dominant deformation mechanisms, and highlights processing ...
Chandan Kumar +3 more
wiley +1 more source
, 1998 It was observed with transmission electron microscopy in the In0.52Al0.48As/InxGa1-xAs/In0.52Al0.48As/InP heterostructure that misfit dislocation lines deviate from the [110] directions at a certain angle depending on the indium content x.
Wu J +3 more
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Impact of Hydrogen Incorporation on Electronic and Magnetic Structure of X2CrNi18‐9 Stainless Steel
Advanced Engineering Materials, EarlyView.Hydrogen uptake in austenitic stainless steel alters both its electronic and magnetic structure. Seebeck measurements reveal hydrogen‐induced shifts in the electronic density of states, while neutron scattering uncovers nanoscale inhomogeneities that grow upon hydrogen incorporation, with the most pronounced effect observed in the PBF as‐built state ...
Torben Tappe +9 more
wiley +1 more source