Results 91 to 100 of about 604 (114)
This study introduced a Ge‐Te‐S co‐sputtering process to resolve the performance trade‐off between GeTe and GeS in OTS selector devices, and improved device durability through nitrogen doping. Furthermore, in a 1S‐1R structure incorporating phase‐change memory devices, it simultaneously achieved excellent thermal stability, durability, high‐speed ...
Min Su Kang +6 more
wiley +1 more source
Wave Propagation in 3‐D Poroelastic Media Accounting for Both Mesoscopic and Global Flow Effects
Abstract Biot's theory of poroelasticity is widely recognized as a fundamental framework for describing wave‐induced fluid flow in mesoscopic heterogeneous porous media. However, dynamic numerical modeling of velocity dispersion and attenuation in heterogeneous porous media remains challenging due to (a) the stiffness of Biot's equations and (b) the ...
Zhiyu Hou +2 more
wiley +1 more source
A high‐energy X‐ray beamline for materials science research at SPring‐8: BL15XU
The Japanese synchrotron facility SPring‐8 has recently relaunched BL15XU as a high‐energy X‐ray beamline for materials science research. A comprehensive description of the technical details and science cases is presented.The high‐energy X‐ray beamline BL15XU is designed to drive advancements in materials science and high‐pressure research by ...
Hiroyuki Ohsumi +17 more
wiley +1 more source
A unique high‐elevation Exoneura bee defies typical elevation‐driven declines in bee activity, nesting exclusively in dead branches of snow gums near the alpine tree line. Nesting and foraging are tightly linked to snow gum presence, with most activity occurring within 30 m of these trees. Biophysical modelling indicates the bee's thermally constrained
Joshua M. Coates +3 more
wiley +1 more source
Nonlinear Variation Decomposition of Neural Networks for Holistic Semiconductor Process Monitoring
Artificial intelligence (AI) is increasingly used to solve multi‐objective problems and reduce the turnaround times of semiconductor processes. However, only brief AI explanations are available for process/device/circuit engineers to provide holistic ...
Hyeok Yun +11 more
doaj +1 more source
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DRAMsim3: A Cycle-Accurate, Thermal-Capable DRAM Simulator
IEEE Computer Architecture Letters, 2020Zhiyuan Yang, Shang Li, Bruce Jacob
exaly
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2023
Ataberk Olgun, Lois Orosa, Onur Mutlu
exaly
Ataberk Olgun, Lois Orosa, Onur Mutlu
exaly
WinDRAM: Weak rows as in‐DRAM cache
Concurrency Computation Practice and Experience, 2022Shirshendu Das
exaly
Understanding Reduced-Voltage Operation in Modern DRAM Devices
Proceedings of the ACM on Measurement and Analysis of Computing Systems, 2017Onur Mutlu +2 more
exaly
A survey of techniques for improving error-resilience of DRAM
Journal of Systems Architecture, 2018Maruthi S Inukonda, Sparsh Mittal
exaly

