Results 131 to 140 of about 2,380,969 (281)

Electrodeposition in Structural Lattices of Variable Architectures

open access: yesAdvanced Engineering Materials, EarlyView.
Electrodeposition enables geometry‐sensitive, autonomous void filling while simultaneously tuning chemical and mechanical properties. The development of approaches that can autonomously fill and heal material voids and yield composites with tailorable properties is increasingly relevant in engineering.
Yeong‐Man Kwon   +3 more
wiley   +1 more source

Phase-field modeling droplet dynamics with soluble surfactants [PDF]

open access: yes, 2010
Using lattice Boltzmann approach, a phase-field model is proposed for simulating droplet motion with soluble surfactants. The model can recover the Langmuir and Frumkin adsorption isotherms in equilibrium.
Zhang, Y.H., Liu, H.
core  

Thermal Cycle–Microstructure–Property Relationships in Rail Steel Heat‐Affected Zone Simulated by Gleeble

open access: yesAdvanced Engineering Materials, EarlyView.
Microstructural evolution of premium rail steel during flash butt welding (FBW), comparing physically simulated heat‐affected zones with actual weld regions. Thermal cycles induce phase transformations and microstructural heterogeneity that influence weld quality and mechanical performance. These findings provide insights into optimizing FBW parameters
Emmanoelle Cintra da Cunha Araújo   +15 more
wiley   +1 more source

Analysis of arc and molten droplet behavior and joint temperature field in KTIG-MIG hybrid welding

open access: yesHanjie xuebao
To address the insufficient deep penetration in conventional keyhole tungsten inert gas-metal inert gas (KTIG-MIG) hybrid welding and enhance the efficiency and quality of medium-thick plate welding, a novel KTIG-MIG hybrid welding method was developed ...
Hongchang ZHANG   +6 more
doaj   +1 more source

Influence of Particle Shape and Size in Copper‐Based Low‐Temperature Metallization Paste for Solar Cells

open access: yesAdvanced Engineering Materials, EarlyView.
Particle morphology controls the balance between printability and electrical connectivity in low‐temperature AgCu/Ag metallization pastes. Flake‐shaped AgCu particles form extended low‐resistance contacts, whereas spherical particles favor processability at high metal loading. Fine Ag particles further tune void filling and conductive‐network formation
O. Mhirsi   +3 more
wiley   +1 more source

Effect of Radiation on Heat Exchange between Slag Droplet and Quenching Gas

open access: yesTeshugang, 2012
The key step to cause the granulation of gas quenching molten slag is the granulated liquid slag droplet quick cooling and solidifying, and during slag droplet cooling process the main manners of heat transfer are convection and radiation.
卢宏伟, 李俊国, 张玉柱
doaj  

Effect of Calendering and Surface Treatment on the Thermochromic Response of Cholesteric Liquid Crystals on PET Nonwovens

open access: yesAdvanced Engineering Materials, EarlyView.
This study explores the influences of calendering and surface treatment during direct ink writing (DIW) of thermochromic cholesteric liquid crystal (CLC) on PET nonwovens. For the PVA‐coated nonwovens, calendering reduces pore size leading to reduced ink absorption and enhanced spreading. The NeverWet‐coated nonwovens improve thermochromic responses by
Sreenivasan Sreenivasan Narayanan   +3 more
wiley   +1 more source

Enhancing Low‐Temperature Performance of Sodium‐Ion Batteries via Anion‐Solvent Interactions

open access: yesAdvanced Functional Materials, EarlyView.
DOL is introduced into electrolytes as a co‐solvent, increasing slat solubility, ion conductivity, and the de‐solvent process, and forming an anion‐rich solvent shell due to its high interaction with anion. With the above virtues, the batteries using this electrolyte exhibit excellent cycling stability at low temperatures. Abstract Sodium‐ion batteries
Cheng Zheng   +7 more
wiley   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

open access: yesAdvanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone   +11 more
wiley   +1 more source

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