Results 221 to 230 of about 24,560 (302)

Multimodal Data‐Driven Microstructure Characterization

open access: yesAdvanced Engineering Materials, EarlyView.
A self‐consistent autonomous workflow for EBSP‐based microstructure segmentation by integrating PCA, GMM clustering, and cNMF with information‐theoretic parameter selection, requiring no user input. An optimal ROI size related to characteristic grain size is identified.
Qi Zhang   +4 more
wiley   +1 more source

Relearning the epistemology, history, and future of neuropsychiatry. [PDF]

open access: yesFront Hum Neurosci
Castro Martínez JC   +9 more
europepmc   +1 more source

Symbolic Regression and Multi‐Objective Optimization of the Flory–Huggins Interaction Parameter for Hydrogels

open access: yesAdvanced Engineering Materials, EarlyView.
We develop a data‐driven method to derive the mathematical expressions of the Flory–Huggins interaction parameter χ for the swelling behavior of temperature–responsive hydrogels. Starting from initial assumptions of χ, our workflow combines Bayesian optimization, Flory–Rehner theory, and symbolic regression to generate candidate χ expressions.
Yawen Wang   +2 more
wiley   +1 more source

Slip Localization Intensification Mediated by Grain Boundary Sliding in a Polycrystalline Nickel‐Based Superalloy

open access: yesAdvanced Engineering Materials, EarlyView.
The temperature dependence of fatigue behavior in nickel‐based superalloys is investigated through high‐resolution measurements of plastic localization. While increasing temperature reduces localization and enhances fatigue performance in René 88DT, Inconel 718 exhibits a sharp degradation at intermediate temperature due to intensified slip ...
M. Calvat   +5 more
wiley   +1 more source

Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators

open access: yesAdvanced Engineering Materials, EarlyView.
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad   +6 more
wiley   +1 more source

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