Results 21 to 30 of about 235,295 (303)

Co-simulation and analysis of electro-magnetic-thermal of aviation carbon fiber composite board

Journal of Hebei University of Science and Technology, 2021
In view of the lack of systematic theoretical research on the multi-field problem of electromagnetic eddy current induction in realizing the rapid internal heating of carbon fiber reinforced composites plastic (CFRP),the electro-magnetic-thermal multi ...
Liguo1 YU, Xiaoming2 HUANG, Zhengbao1 DONG, Wentao2 YOU, Zhou1 SU, Zhong'ao1 CHEN   +5 more
doaj   +1 more source

Energy Recovery From Microstrip Passive Circuits

IEEE Access, 2016
In this paper, the energy recovery in microstrip passive circuits from the power losses into heat is studied. For this purpose, a thermoelectric generator (TEG) based on the Seebeck effect principle is used, which converts part of the power dissipated ...
Miguel A. Sanchez-Soriano, Yves Quere, Vincent Le Saux, Cedric Quendo   +3 more
doaj   +1 more source

Electro-Thermo-Mechanical Response of Thick-Walled Piezoelectric Cylinder Reinforced by BNNTs [PDF]

Journal of Nanostructures, 2012
Electro-thermo-elastic stress analysis of piezoelectric polymeric thick-walled cylinder reinforced by boronnitride nanotubes (BNNTs) subjected to electro-thermo-mechanical fields is presented in this article.
A. Ghorbanpour Arani, A. Haghshenas, S. Amir, M. Azami, Z. Khoddami Maraghi   +4 more
doaj   +1 more source

Damping of Fe-Al Alloy Electrodeposited in an Ionic Liquid [PDF]

, 2018
Iron-Aluminium alloys were produced by the electro-deposition of iron-aluminium on a copper substrate. The electro-deposition process was done in the ionic liquid 1-butyl-1-methylpyrrolidinium trifluoromethylsulfonate, [Py1,4]TfO.
Bernd Weidenfeller (5341862), Federico Guillermo Bonifacich (5341859), Frank Endres (1362063), Giridar Pulletikurthi (5862863), Jiayi Xu (2287153), Laura Weidenfeller (5862866), Osvaldo Agustin Lambri (5862851)   +6 more
core   +2 more sources

Electro-thermal coupling analysis methodology for RF circuits [PDF]

Microelectronics Journal, 2012
In this paper an electro-thermal co-simulation methodology suitable for RF circuits is presented. It circumvents traditional transient simulation drawbacks that arise when signals or magnitudes whose frequencies are separated orders of magnitude are present simultaneously in the simulated circuit.
Gómez Salinas, Didac, Dufis, Cédric Yvan, Altet Sanahujes, Josep, Mateo Peña, Diego, González Jiménez, José Luis   +4 more
openaire   +3 more sources

Electro-kinetic technology as a low-cost method for dewatering food by-product [PDF]

, 2011
Increasing volumes of food waste, intense environmental awareness, and stringent legislation have imposed increased demands upon conventional food waste management.
Andrew Plunkett, Chris White, Chung L.L., David Russell, Jean Hall, John Lamont-Black, Krishnaswamy P., Morley N., Mujumdar A., Paul Ainsworth, Sing K. Ng, Stephanie Glendenning, Valentina Stojceska, Williams S.   +13 more
core   +1 more source

Suppression of extraneous thermal noise in cavity optomechanics [PDF]

, 2011
Extraneous thermal motion can limit displacement sensitivity and radiation pressure effects, such as optical cooling, in a cavity-optomechanical system. Here we present an active noise suppression scheme and its experimental implementation.
Anetsberger, Arcizet, Aspelmeyer, Black, Braginsky, Braginsky, Butt, Callen, Carmon, Chan, Cleland, Cleland, Cohadon, Cole, Dalziel J. Wilson, Diósi, Drever, Eichenfield, Gabrielson, Genes, Gillespie, Gröblacher, H. J. Kimble, Harry, Jayich, K.-K. Ni, Kippenberg, Marquardt, Marquardt, Metzger, Numata, O’Connell, Penn, Phelps, Pinard, Poggio, Rabl, Riviere, Sankey, Santamore, Saulson, Sheard, Teufel, Thompson, Wilson, Wilson-Rae, Yi Zhao, Zwickl   +47 more
core   +3 more sources

When self-consistency makes a difference [PDF]

, 2008
Compound semiconductor power RF and microwave device modeling requires, in many cases, the use of selfconsistent electrothermal equivalent circuits.
Bonani, Fabrizio, Camarchia, Vittorio, Cappelluti, Federica, Donati Guerrieri, Simona, Ghione, Giovanni, Pirola, Marco   +5 more
core   +1 more source

PCB-level Electro thermal Coupling Simulation Analysis

Journal of Physics: Conference Series, 2017
Power transmission network needs to transmit more current with the increase of the power density. The problem of temperature rise and the reliability is becoming more and more serious. In order to accurately design the power supply system, we must consider the influence of the power supply system including Joule heat, air convection and other factors ...
Runjing Zhou, Xuchen Shao
openaire   +1 more source

Simulation analysis of the electro-thermal performance of SOI FinFETs [PDF]

2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2016
The GSS `atomistic' simulator GARAND has been enhanced with a thermal simulation module to investigate the impact of self-heating on FinFET DC operation. This thermal simulation module is based on the solution of the coupled Heat Flow, Poisson, and Current Continuity Equations, which is developed for the benefit of computational efficiency.
Wang, L., Sadi, T., Brown, A.R., Nedjalkov, M., Alexander, C., Cheng, B., Millar, C., Asenov, A.   +7 more
openaire   +1 more source