Electrical Resistance Activation of Embedded Fe-SMA Rebars in Pre-Cracked UHPFRC Beams: Internal Temperature Evolution and Calibrated Electro-Thermal Simulation. [PDF]
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The Failure of Voltage Divider Induced by Insulating Material Degradation Under Coupling Effect of High-Frequency Field and Temperature. [PDF]
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Mid-IR light modulators enabled by dynamically tunable ultra-high-Q silicon membrane metasurfaces. [PDF]
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Detection, Reconstruction, and Overheating Warning of Three-Dimensional Dynamic Temperature Fields Inside Conductive Polymer Gels. [PDF]
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Electro-thermal coupling model of supercapacitor for online application
2019 IEEE 4th International Future Energy Electronics Conference (IFEEC), 2019Online temperature observation is very important for the health diagnosis and safe operation of the supercapacitor energy storage system. The paper presents an electro-thermal coupling model to estimate the temperature in supercapacitor. Firstly, an electro-thermal coupling model is built for the purpose of online temperature observation.
Ming Wu, Li Wei, Yuzhuo Shen
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The investigation of electro-thermal sub-strong coupling model of IGBT module
2015 IEEE International Conference on Applied Superconductivity and Electromagnetic Devices (ASEMD), 2015The junction temperature prediction of IGBT module is related to its temperature and current, so it involves coupled electro-thermal calculation. This paper proposes electro-thermal sub-strong coupling model of IGBT modules. Due to the electro-thermal indivisibility of IGBT module, this paper only considers part of coupling terms under the condition of
Yu Jiao Zhang, Gang Liang Wu
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Transient Electro-Thermal Coupled System Simulation - Modeling Approach and Experimental Validation
This contribution describes an approach for modeling a coupled electro-thermal design problem for the transient system simulation based on the analog circuit simulator SPICE - means: the time-varying electrical functional behavior of several neighboring components influence the time-varying thermal behavior of the setup and interconnection environment,
Ralph Schacht, Sven Rzepka
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Distributed and coupled 2D electro-thermal model of power semiconductor devices
The development of power electronics in the field of transportations (automotive, aeronautics) requires the use of power semiconductor devices providing protection and diagnostic functions. In the case of series protections power semiconductor devices which provide protection may operate in shortcircuit and act as a current limiting device.
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