Results 241 to 250 of about 104,472 (281)

The investigation of electro-thermal sub-strong coupling model of IGBT module

2015 IEEE International Conference on Applied Superconductivity and Electromagnetic Devices (ASEMD), 2015
The junction temperature prediction of IGBT module is related to its temperature and current, so it involves coupled electro-thermal calculation. This paper proposes electro-thermal sub-strong coupling model of IGBT modules. Due to the electro-thermal indivisibility of IGBT module, this paper only considers part of coupling terms under the condition of
Yu Jiao Zhang, Gang Liang Wu
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Electro-thermal coupling model of lithium-ion batteries under external short circuit

Applied Energy, 2021
Abstract External short circuit (ESC) fault, which can cause large current and high temperature, is one of the main reasons for battery failure. Its analysis and diagnosis remains a challenging task due to complex electro-thermal characteristics of batteries under ESCs.
Chen, Zeyu, Zhang, Bo, Xiong, Rui, Shen, Weixiang, Yu, Quanqing   +4 more
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Study on electro-thermal coupling optimal power flow model and its simplification

IEEE PES General Meeting, 2010
A new optimal power flow (OPF) model accounts for electro-thermal coupling relationship is established based on electro-thermal coordination (ETC) concept in this paper This new OPF model organically combines the traditional OPF with heat balance equation (HBE) which reflects thermal dynamic process of transmission component.
null Meng-Xia Wang, null Xue-Shan Han
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A framework for battery temperature estimation based on fractional electro-thermal coupling model

Journal of Energy Storage, 2023
Shichuang Liu, Huanwu Sun, Haotong Yu, Jian Miao, Cao Zheng, Xiuwei Zhang   +5 more
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Modeling and Analysis of IGBT Power Module Electro-thermal Coupling Model

2021 IEEE 4th International Electrical and Energy Conference (CIEEC), 2021
Power semiconductor devices play a key role in aerospace, electric vehicles, medical and so on. As the main force in power semiconductor devices, IGBT is currently the most advantageous power semiconductor device. Firstly, this paper proposes a power loss calculation model based on the average loss of the switching period.
Xianrong Fan, Yufeng Wang, Weilin Li
openaire   +1 more source

Coupled electro-thermal modeling and optimization of clock networks

Microelectronics Journal, 2003
In this paper a coupled electro-thermal model is used for the optimal design of the clock distribution tree of a high performance microprocessor. Such approach allows simultaneously to take into account both thermal and electrical constraints. In particular timing issues such as clock delay from the root of the tree to the leaves and skew between the ...
CASU, MARIO ROBERTO, GRAZIANO, MARIAGRAZIA, MASERA, Guido, PICCININI, GIANLUCA, ZAMBONI, Maurizio   +4 more
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New Electro-Thermal Integrated Circuit Modeling using Coupling of Simulators

2006 Canadian Conference on Electrical and Computer Engineering, 2006
This paper describes a methodology developed to perform electro-thermal analysis of integrated circuits. This method is based on the relaxation approach. A circuit simulator and a thermal simulator which is a finite element program are coupled by an interface program.
S. Sharifian Attar, Mustapha Chérif-Eddine Yagoub, F. Mohammadi   +2 more
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Coupled Electro-Thermal-Phase Change Modeling of a Chalcogenide Switch

Heat Transfer, Volume 3, 2006
A coupled electro-thermal-phase change numerical model is developed to model the threshold and memory switching processes in a chalcogenide switch based on phase change memory (PCM) technology. Coupled electrical and thermal transport coupled to phase change and crystallization kinetics are solved. Charge transport has been implemented using simplified
Navdeep Singh Dhillon, Jayathi Y. Murthy
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Package Reliability Analysis with Coupled Electro-Thermal and Mechanical Modeling

MRS Proceedings, 2013
ABSTRACTPower consumption and dissipation during electrical operation lead to a temperature rise in the package. Elevated temperature in the package structure induces thermo-mechanical stresses which may increase reliability risks. Robust and reliable package design for power systems requires comprehensive analysis of system electrical, thermal, and ...
Chan-Su Yun, Xiaopeng Xu, Arsen Terterian, Tommaso Cilento   +3 more
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Parametric Model Order Reduction for Electro-Thermal Coupled Problems

2019
We consider automatic parametric model order reduction for electro-thermal (ET) coupled problems arising from (nano-)microelectronic simulations. We show that the PMOR method based on multi-moment matching proposed in [2] can be applied to the discretized ET models. The error bound in [6] is used to check the accuracy of the reduced models.
Lihong Feng, Peter Benner
openaire   +3 more sources