Results 41 to 50 of about 197,190 (304)

Interactions between Molten High‐Silicon Electrical Steels and Carbon‐Bonded MgO Refractories Based on Recyclates

open access: yesAdvanced Engineering Materials, EarlyView.
This study examines how several molten high‐silicon electrical steels interact with both conventional and recycled MgO–C refractories. For this, various immersion experiments are conducted. In addition to infiltration, a number of mechanisms are identified and explained that control the corrosion of the refractory material.
Lukas Neubert   +7 more
wiley   +1 more source

Thermal characterization methodologies for experimental minichannel heat sink designs in printed circuit board assemblies

open access: yesCase Studies in Thermal Engineering
There has been a growing demand for novel, highly efficient, power-saving cooling solutions in recent years. In many cases, standard cooling techniques offer only limited opportunities to prevent the overheating of circuits.
Gy. Bognár, P.G. Szabó, G. Takács
doaj   +1 more source

Prolonged silicon carbide integrated circuit operation in Venus surface atmospheric conditions

open access: yesAIP Advances, 2016
The prolonged operation of semiconductor integrated circuits (ICs) needed for long-duration exploration of the surface of Venus has proven insurmountably challenging to date due to the ∼ 460 °C, ∼ 9.4 MPa caustic environment.
Philip G. Neudeck   +5 more
doaj   +1 more source

The Layer 0 Inner Silicon Detector of the D0 Experiment

open access: yes, 2009
This paper describes the design, fabrication, installation and performance of the new inner layer called Layer 0 (L0) that was inserted in the existing Run IIa Silicon Micro-Strip Tracker (SMT) of the D0 experiment at the Fermilab Tevatron collider.
A. Bean   +54 more
core   +1 more source

Can Ti‐Based MXenes Serve as Solid Lubricants for Brake Applications? A Tribological Study

open access: yesAdvanced Engineering Materials, EarlyView.
This study explores the first implementation of Ti‐based MXenes materials in brake pad friction composite material. The resulting composite material exhibits a 48% reduction in the wear rate; alongside significant improvements are observed for thermal and mechanical properties.
Eslam Mahmoud   +7 more
wiley   +1 more source

Radiative cooling drives the integration and application of thermal management in flexible electronic devices

open access: yesnpj Flexible Electronics
Flexible electronics advancement intensifies thermal management needs. Radiative cooling shows promise but faces implementation challenges. Integration into diverse flexible electronics demands application-specific materials and processes.
Maoquan Zhang   +3 more
doaj   +1 more source

STK: A new CCD camera at the University Observatory Jena [PDF]

open access: yes, 2010
The Schmidt-Teleskop-Kamera (STK) is a new CCD-imager, which is operated since begin of 2009 at the University Observatory Jena. This article describes the main characteristics of the new camera.
Bessell   +5 more
core   +1 more source

Cooling rate for microbunched electron cooling without amplification [PDF]

open access: yesPhysical Review Accelerators and Beams, 2018
The Microbunched Electron Cooling (MBEC) proposed by D. Ratner is a promising cooling technique that can find applications in future hadron and electron-ion colliders. In this paper, we develop a new framework for the study of MBEC which is based on the analysis of the dynamics of microscopic 1D fluctuations in the electron and hadron beams during ...
openaire   +3 more sources

Interaction between Molten Al‐Killed Mn–B Steel and Carbon‐Bonded MgO Refractories Based on Recyclates

open access: yesAdvanced Engineering Materials, EarlyView.
High‐temperature interactions between low‐sulfur Al‐killed Mn–B steel and MgO–C refractories (0 and 50 wt% recyclates) are studied via finger immersion tests (1600 °C). Surface‐active elements influence infiltration. MgO/CaS layer forms, along with spinel and calcium silicate.
Matheus Roberto Bellé   +5 more
wiley   +1 more source

Single-molecule Electronics: Cooling Individual Vibrational Modes by the Tunneling Current

open access: yes, 2015
Electronic devices composed of single molecules constitute the ultimate limit in the continued downscaling of electronic components. A key challenge for single-molecule electronics is to control the temperature of these junctions. Controlling heating and
Gagliardi, Alessio   +4 more
core   +1 more source

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