Results 41 to 50 of about 197,562 (202)

Single-molecule Electronics: Cooling Individual Vibrational Modes by the Tunneling Current

, 2015
Electronic devices composed of single molecules constitute the ultimate limit in the continued downscaling of electronic components. A key challenge for single-molecule electronics is to control the temperature of these junctions. Controlling heating and
Gagliardi, Alessio, Lykkebo, Jacob, Pecchia, Alessandro, Romano, Giuseppe, Solomon, Gemma C.   +4 more
core   +1 more source

Experimental investigation of non-uniform heating effect on flow boiling instabilities in a microchannel-based heat sink [PDF]

, 2011
Copyright @ 2011 ElsevierTwo-phase flow boiling in microchannels is one of the most promising cooling technologies for coping with high heat fluxes produced by the next generation of central processor units (CPUs).
A.J. Walton, Bergles, Bogojevic, D. Bogojevic, D.B.R. Kenning, G. Cummins, H. Lin, Hetsroni, K. Sefiane, Kandlikar, Kenning, Kosar, Lin, Qu, Revellin, T.G. Karayiannis, Wang, Zhang   +17 more
core   +1 more source

Radiative cooling drives the integration and application of thermal management in flexible electronic devices

npj Flexible Electronics
Flexible electronics advancement intensifies thermal management needs. Radiative cooling shows promise but faces implementation challenges. Integration into diverse flexible electronics demands application-specific materials and processes.
Maoquan Zhang, Xuwang Tian, Jiajia Shen, Jianhua Yan   +3 more
doaj   +1 more source

The Layer 0 Inner Silicon Detector of the D0 Experiment

, 2009
This paper describes the design, fabrication, installation and performance of the new inner layer called Layer 0 (L0) that was inserted in the existing Run IIa Silicon Micro-Strip Tracker (SMT) of the D0 experiment at the Fermilab Tevatron collider.
A. Bean, A. Nomerotski, A. Zieminski, C.E. Gerber, C.H. Daly, Cooper, D. Buchholz, D. Butler, D. Markley, D. Olis, D. Strom, D. Tsybychev, E. Shabalina, F. Lehner, G.J. Otero y Garzón, Garcia-Sciveres, H. Gonzalez, H. Guldenman, H.J. Lubatti, J. Foglesong, J. Green, J. Howell, J. Wang, K. Hanagaki, K. Herner, K. Krempetz, K. Schultz, Krieger, L. Bagby, L. Christofek, Lutz, M. Demarteau, M. Hrycyk, M. Johnson, M. Kirby, M. Matulik, M. Roman, M. Tuttle, M. Utes, M. Weber, R. Angstadt, R. Lipton, R. Rucinski, R.D. Taylor, R.L. McCarthy, R.P. Smith, S.W. Youn, T. Bolton, T. Wesson, T. Zhou, W. Kuykendall, W.E. Cooper, Y. Orlov, Zimmerman, Zimmerman   +54 more
core   +1 more source

Evolution and Modern Approaches for Thermal Analysis of Electrical Machines [PDF]

, 2009
In this paper, the authors present an extended survey on the evolution and the modern approaches in the thermal analysis of electrical machines. The improvements and the new techniques proposed in the last decade are analyzed in depth and compared in ...
Boglietti, Aldo, Cavagnino, Andrea, Mejuto, C., Mueller, M., Shanel, M., Staton, D.   +5 more
core   +1 more source

Cooling rate for microbunched electron cooling without amplification [PDF]

Physical Review Accelerators and Beams, 2018
The Microbunched Electron Cooling (MBEC) proposed by D. Ratner is a promising cooling technique that can find applications in future hadron and electron-ion colliders. In this paper, we develop a new framework for the study of MBEC which is based on the analysis of the dynamics of microscopic 1D fluctuations in the electron and hadron beams during ...
openaire   +3 more sources

Review of Cryogenic Power Electronics for All-Electric Aircraft

IEEE Access
To tackle emissions from the aviation industry and make it sustainable, research has been targeting electrifying aircraft. For this aim, articles have been focusing on how to replace regular jet engines with liquid hydrogen as fuel.
Abdelrahman Elwakeel, Yuchuan Liao, Yudi Xiao, Rafael Pena Alzola, Min Zhang, Weijia Yuan   +5 more
doaj   +1 more source

Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration

Nature Communications, 2022
Efficient thermal structure and precise heat management become a substantial challenge for electronics. Here, authors utilize the synergistic effect of classic heat transfer and electrocaloric cooling for fixed-point thermal management of chips.
Ming-Ding Li, Xiao-Quan Shen, Xin Chen, Jia-Ming Gan, Fang Wang, Jian Li, Xiao-Liang Wang, Qun-Dong Shen   +7 more
doaj   +1 more source

Cooling and Diffusion Rates in Coherent Electron Cooling Concepts

, 2021
Proceedings of the 12th International Particle Accelerator Conference, IPAC2021, Campinas, SP ...
Nagaitsev, Sergei, Lebedev, Valeri, Stupakov, Gennady, Wang, Erdong, Bergan, William   +4 more
openaire   +2 more sources

Breathable cooling solutions strengthened by ionic liquids for passive thermal management toward sustainable intelligentization

Nexus
The rapid development of electronics calls for sustainable thermal management solutions to tackle the rising energy and water demands for cooling. Passive thermal management technologies have emerged as a promising solution to reduce energy and water ...
Yunren Sui, Zengguang Sui, Tiantian Liu, Wei Wu   +3 more
doaj   +1 more source