Results 51 to 60 of about 197,562 (202)

Experimental Study on Thermal Performance of a Loop Heat Pipe with Different Working Wick Materials

Energies, 2021
In loop heat pipes (LHPs), wick materials and their structures are important in achieving continuous heat transfer with a favorable distribution of the working fluid. This article introduces the characteristics of loop heat pipes with different wicks: (i)
Kyaw Zin Htoo, Phuoc Hien Huynh, Keishi Kariya, Akio Miyara   +3 more
doaj   +1 more source

STK: A new CCD camera at the University Observatory Jena [PDF]

, 2010
The Schmidt-Teleskop-Kamera (STK) is a new CCD-imager, which is operated since begin of 2009 at the University Observatory Jena. This article describes the main characteristics of the new camera.
Bessell, Fukugita, Mugrauer, Mugrauer, Pfau, Skrutskie   +5 more
core   +1 more source

Comment on “Coherent Electron Cooling”

Physical Review Letters, 2013
A Comment on the Letter by V. N. Litvinenko and Y. S. Derbenev, Phys. Rev. Lett. 102, 114801 (2009). The authors of the Letter offer a Reply.
G, Stupakov, M S, Zolotorev
openaire   +3 more sources

Numerical Investigation of Miniature Ejector Refrigeration System Embedded with a Capillary Pump Loop

Micromachines, 2017
A miniature steam ejector refrigeration system embedded with a capillary pump loop can result in a compact design which can be used for electronics cooling.
Jing-Ming Dong, He Song, Meng-Qi Yu, Wei-Ning Wang, Xin-Xiang Pan   +4 more
doaj   +1 more source

Constructal Optimizations of Liquid-Cooled Channels with Triangle or Square Sections in a Cylindrical Heating Body

Mathematics, 2023
Two new integrated models with heat source–heat sink are established, in which isothermal liquid cooling channels with triangle or square sections are, respectively, embedded in a cylindrical heating body with uniform heat production.
Yunfeng Li, Zhihui Xie, Daoguang Lin, Zhuoqun Lu, Yanlin Ge   +4 more
doaj   +1 more source

Cooling the Electronic Brain [PDF]

Mechanical Engineering, 2011
This article discusses findings of some immersion cooling studies carried out to define the potential of direct liquid cooling of three-dimensional chip stacks. Four possible immersion cooling strategies were assessed. These included two active cooling strategies and two passive cooling strategies.
Avram Bar-Cohen, Karl J. L. Geisler
openaire   +1 more source

High-performance integrated thermoelectric coolers for electronics cooling

Communications Materials
Thermoelectric coolers (TECs), which can directly convert energy between electricity and heat, have emerged as a promising solution for electronics cooling.
Wusheng Fan, Zan Wu, Sihui Hong, Kuang Sheng   +3 more
doaj   +1 more source

Development and Prospects of Manifold Microchannel Heat Sink Research

Zhileng xuebao, 2023
With rapid development of electronic devices, modern electronic devices require higher power and exhibit more heat flow density. Consequently, their thermal management requirements have increased drastically.
Zhu Xunyi, Chen Chaowei, Zhang Jingzhi, Xin Gongming   +3 more
doaj  

Experimental Study on a Miniature Refrigeration System for Electronics Cooling

Zhileng xuebao, 2014
With the improvement of electronics performance, the problem of heat dissipation in circuit and chip is becoming more serious, development of high-efficiency electronics cooling systems is urgently needed, and vapor compression refrigeration is believed ...
Liu Gang, Wu Yuting, Lei Biao, Ma Rui, Ma Chongfang   +4 more
doaj  

Analysis of The Effect of Heat Treatment on Changes in Mechanical Properties and Electronic Performance of Thin Foil for Electronic Components [PDF]

E3S Web of Conferences
The rapid development of the electronics industry creates a need for small-sized materials with good mechanical properties and electronic performance to improve efficiency during production. However, in thin materials deformation is prone to occur during
Aziz Abdul, Fitrullah Muhammad, Suryana, Senja Aulia Kemuning, Sulaiman Fatah, Santoso Muhammad Iman   +5 more
doaj   +1 more source