Results 211 to 220 of about 74,061 (310)

Engineering Gap‐Enhanced Raman Tags for High‐Performance Security Inks: A Focus on Raman Tag Density and Stability

open access: yesAdvanced Materials Interfaces, EarlyView.
Gap‐enhanced Raman tags (GERTs) with optimized tag density and stability are engineered for use in high‐performance security inks. The inks enable invisible molecular‐level encoding, long‐term signal retention, and high sensitivity. This work demonstrates a robust, scalable platform for anti‐counterfeiting and authentication with potential integration ...
Boonphop Chaisrikhwun   +4 more
wiley   +1 more source

Implantable Microarray Patch: Engineering at the Nano and Macro Scale for Sustained Therapeutic Release via Synthetic Biodegradable Polymers

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
This review focuses on the application of synthetic biodegradable microarray patches (MAPs) in sustained drug delivery. Compared to conventional MAPs which release drugs into the skin in an immediate manner, these implantable MAPs release drugs into skin microcirculation gradually as the biodegradable polymers degrade, thus offering sustained release ...
Li Zhao   +6 more
wiley   +1 more source

3D Printing of Highly Electrically Conductive Zinc for Sustainable Electronics Applications

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
A 3D printable zinc ink system with active zinc particles in a shellac matrix is demonstrated. The results show high conductivity, stable performance of printed structures under varying humidity conditions, and promising application in disposable water‐activated batteries. This technology combining digital material assembly, reliable operation, and non‐
Xavier Aeby   +5 more
wiley   +1 more source

Progress in Flexible Perovskite Solar Cells: Paving the Way for Scalable Manufacturing

open access: yesAdvanced Materials Technologies, EarlyView.
Perovskite solar cells (PSCs) are well positioned for a successful market uptake. This is due to an unprecedented improvement of their efficiency and stability since the first report in 2009. In this review paper, the building blocks for the scalable manufacturing and future commercialization of flexible PSCs and their pathway to impact will be ...
Dimitar I. Kutsarov   +5 more
wiley   +1 more source

Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging

open access: yesAdvanced Materials Technologies, EarlyView.
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek   +4 more
wiley   +1 more source

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