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Organosilicon Epoxy-compounds

Russian Chemical Reviews, 1973
The review deals with methods for the synthesis of monomeric organosilicon epoxy-compounds and some of their reactions. The possibility of employing these compounds for the synthesis of organosilicon polyepoxides is demonstrated and some of their properties are described. The bibliography includes 46 references.
L V Nozdrina   +2 more
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Occupational Asthma From Epoxy Compounds

The Journal of Allergy and Clinical Immunology: In Practice, 2019
Two-component epoxy resin systems (ERSs) composed of epoxy resin and polyamine hardeners are extensively used in industrial and construction coating. Triglycidyl isocyanurate (TGIC) is another type of epoxy derivative, mostly encountered in polyester powder paints.
Suojalehto, H   +4 more
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Studies on epoxy compound fixation

Journal of Biomedical Materials Research, 1996
Bioprostheses derived from collagenous tissues have to be fixed and subsequently sterilized before they can be implanted in humans. Clinically, the most commonly used fixative is glutaraldehyde. However, the tendency for glutaraldehyde to markedly alter tissue stiffness and promote tissue calcification are well-recognized drawbacks of this fixative. To
H W, Sung   +4 more
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Occupational dermatoses from epoxy resin compounds

Contact Dermatitis, 1990
This study comprises 40 patients with skin disorders from current or previous occupational exposure to epoxy resin compounds (ERC) during 1984–1988. ERCs were the 3rd most common cause(32 of 264 cases; 12.1%) of currently relevant allergic contact dermatitis: 23 cases from epoxy resins based on the diglycidyl ether of bisphenol A (DGEBA‐ERs).
R, Jolanki   +5 more
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Sulfur-containing compound in epoxy molding compound

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy, 2014
With the rapid development of the semiconductor filed, more and more challenges have been put forward to the packaging materials as well. Epoxy molding compound (EMC) as one the most important packaging material with the monopoly position was required for low water absorption, high adhesion, and low internal stress and so on. Here, adhesion improvement
Xingming Cheng   +5 more
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Polymerization compounding: Epoxy‐montmorillonite nanocomposites

Polymer Engineering & Science, 2002
AbstractA strategy to design intercalated montmorillonite nanocomposites has been explored. A commercial organoclay, 1.34 TCN (Nanocor Inc.), with bis(2‐hydroxylethy1) methy1 tallow ammonium, was modified by tolylene 2,4‐diisocyanate (TDI) and bisphenol A (BA).
Wei Feng   +2 more
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Self‐curing epoxy compounds

Journal of Applied Polymer Science, 1990
AbstractA new series including eight structurally different self‐curing epoxy compounds bearing azomethine linkages were synthesized, characterized and polymerized. 4‐(2,3‐Epoxypropoxy)‐benzaldehyde (EPB) or 2,3‐epoxypropyl glyoxylate monohydrate (EPG), prepared by reacting 4‐hydroxybenzaldehyde or glyoxylic acid monohydrate, respectively, with excess ...
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Epoxy molding compound for fingerprint sensor

2016 International Conference on Electronics Packaging (ICEP), 2016
The fingerprint sensor is promising as a personal identification method for the devices. For downsizing and the cost reduction of the fingerprint sensor, capacitance method is main stream for the portable devices such as Smartphone's. Conventionally, expensive sapphire glass has been used as insulating layer of fingerprint sensor, but sapphire glass is
Junichi Tabei   +2 more
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